Mario Pacheco

Assembly Test and Technology Development Failure Analysis Labs

Intel Corporation

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Publications

マルチスケール三次元マイクロエレクト​​ロニクスパッケージを調査するために放射光マイクロトモグラフィーを用いて、

1Materials Engineering Division, Lawrence Livermore National Laboratory, 2Assembly Test and Technology Development Failure Analysis Labs, Intel Corporation, 3Advanced Light Source, Lawrence Berkeley National Laboratory

JoVE 53683

 Engineering