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Journal
Engineering
A Comprehensive Approach to Investigate RMU Temperature Rise Problem
A Comprehensive Approach to Investigate RMU Temperature Rise Problem
July 05, 2024
リング本体の温度上昇シミュレーションの比較検討
01:45 min
•
282 Views
リング本体の温度上昇問題に対処するための2つの温度場解きモジュールの比較
02:52 min
•
218 Views
Xiang Wang
1
,
Qianxi Sun
1
,
Chengji Lu
2
,
Minkai Zhang
2
,
Jiangcheng Jin
2
,
Linsen Mu
3
,
Enlin Li
3
,
Anxin Wang
3
,
Mingge Wu
1,2,3,4
1
College of Mechanical and Electrical Engineering
,
Wenzhou University
,
2
Institute of Laser and Optoelectronic Intelligent Manufacturing
,
Wenzhou University
,
3
Wecome Intelligent Manufacturing Co., Ltd.
,
4
College of Mechanical Engineering
,
Nanjing University of Aeronautics and Astronautics
Summary
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Automatically Generated
本稿では、リング本体の温度上昇問題に、簡易モデルを確立し、2つの温度場解モジュールで比較解析を行うことで対処します。
Article