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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
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Capítulos
- 00:05Título
- 01:10Interconnector Fabrication
- 04:12Assembly and Disassembly of Reusable Microfluidic Chips with an Electrical Interface
- 06:21Results: Comparison of Interconnectors for Rapid Prototyping
- 07:29Conclusion
In this article we describe different techniques for microfluidic rapid prototyping platforms. The proposed techniques are based on ultraviolet (UV) sensitive and temperature curing epoxies, polydimethylsiloxane (PDMS) based tubing, wire-bonding, and anisotropic adhesive films. The assembling procedures presented are developed for both one-time use devices as well as reusable microfluidic systems.
