Fraunhofer Institute for Ceramic Technologies and Systems 2 articles published in JoVE Environment Dispersion of Nanomaterials in Aqueous Media: Towards Protocol Optimization Inder Kaur1, Laura-Jayne Ellis1, Isabella Romer1, Ratna Tantra2, Marie Carriere3,4, Soline Allard5, Martine Mayne-L'Hermite5, Caterina Minelli6, Wolfgang Unger7, Annegret Potthoff8, Steffi Rades7, Eugenia Valsami-Jones1 1School of Geography, Earth and Environmental Sciences, University of Birmingham, 2Analytical Science, National Physical Laboratory, 3INAC-LCIB, Université Grenoble Alpes, 4CEA, INAC-SyMMES, 5NIMBE, CEA, CNRS, Université Paris-Saclay, CEA Saclay, 6Chemical, Medical and Environmental Science, National Physical Laboratory, 7BAM Division 6.1 'Surface Analysis and Interfacial Chemistry', BAM Federal Institute for Materials Research and Testing, 8Fraunhofer Institute for Ceramic Technologies and Systems Here, we present a step-wise protocol for the dispersion of nanomaterials in aqueous media with real-time characterization to identify the optimal sonication conditions, intensity, and duration for improved stability and uniformity of nanoparticle dispersions without impacting the sample integrity. Engineering In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices Zhongquan Liao1,2, Martin Gall1, Kong Boon Yeap1,3, Christoph Sander1, André Clausner1, Uwe Mühle1, Jürgen Gluch1, Yvonne Standke1, Oliver Aubel4, Armand Beyer4, Meike Hauschildt4, Ehrenfried Zschech1,2 1Fraunhofer Institute for Ceramic Technologies and Systems, 2Dresden Center for Nanoanalysis, Technische Universität Dresden, 3Globalfoundries Fab 8, 4Globalfoundries Fab 1 The time-dependent dielectric breakdown (TDDB) in on-chip interconnect stacks is one of the most critical failure mechanisms for microelectronic devices. This paper demonstrates the procedure of an in situ TDDB experiment in the transmission electron microscope, which opens a possibility to study the failure mechanism in microelectronic products.
