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Bioengineering

High Throughput Microfluidic Rapid en Low Cost Prototyping Verpakking

Published: December 23, 2013 doi: 10.3791/50735

Materials

Name Company Catalog Number Comments
Epoxy 731 Epotek 731
PDMS Dow Corning SYLGARD 184
UV Epoxy Epotek OG159
Micropump Harvard Apparatus PHD Ultra
PCB Advanced Circuits
Plexiglass Ecole Polytechnique
Adhesive conductive film 3M 9703

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References

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  3. Hwang, S., et al. CMOS Microelectrode Array for Electrochemical Lab-on-a-Chip Applications. IEEE J. Sensors. 9, 609-615 (2009).
  4. Dürr, M., Kentsch, J., Müller, T., Schnelle, T., Stelzle, M. Microdevices for manipulation and accumulation of micro- and nanoparticles by dielectrophoresis. Electrophoresis. 24, 722-731 (2003).
  5. Chuang, C. H., Huang, Y. W., Wu, Y. T. Dielectrophoretic chip with multilayer electrodes and micro-cavity array for trapping and programmably releasing single cells. Biomed. Microdev. 14, 271-278 (2012).
  6. Xie, L., Premachandran, C., Chew, M., Chong, S. C. Development of a Disposable Bio-Microfluidic Package With Reagents Self-Contained Reservoirs and Micro-Valves for a DNA Lab-on-a-Chip (LOC) Application. IEEE Trans. Adv. Packag. 32, 528-535 (2009).
  7. J. Beebe, D., et al. Functional hydrogel structures for autonomous flow control inside microfluidic channels. Lett. Nat. 404, 588-590 (2000).
  8. Howlader, M., et al. Room-temperature microfluidics packaging using sequential plasma activation process. IEEE Trans. Adv. Packag. 29, 448-456 (2006).
  9. Farris, S., Vitek, J., Giroux, M. L. Deep brain stimulation hardware complications: The role of electrode impedance and current measurements. Mov. Disord. 23, 755-760 (2008).
  10. Nelson, M. J., Pouget, P. Do Electrode Properties Create a Problem in Interpreting Local Field Potential Recordings. J. Neurophysiol. 103, 2315-2317 (2010).
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  12. Ye, X., Kim, W. S., Rubakhin, S. S., Sweedler, J. V. Measurement of nitric oxide by 4,5-diaminofluorescein without interferences. Analyst. 129, 1200-1205 (2004).
  13. Hwang, S., et al. CMOS Microelectrode Array for Electrochemical Lab-on-a-Chip Applications. IEEE J. Sensors. 9, 609-615 (2009).
  14. Kaler, K. V. I. S., Dalton, C. A cost effective, re-configurable electrokinetic microfluidic chip platform. Sens. Actuators B Chem. 123, 628-635 (2007).
  15. Miled, M. A., Sawan, M. Interconnecting Microtubes in Microfluidic Applications. CMC application note. , (2012).
  16. Galliano, A., Bistac, S., Schultz, J. Adhesion and friction of PDMS networks: molecular weight effects. J. Colloid Interface Sci. 265, 372-379 (2003).
  17. Miled, M. A., Sawan, M. Removable PDMS-based Interconnector for Low-pressure Microfluidic Applications. CMC application note. , (2012).
  18. Miled, M. A., Sawan, M. An Assembly Technique for Reusable Microfluidic Chips with Electrical Interface. CMC application note. , (2012).
  19. Li, S., Chen, S. Polydimethylsioxane fluidic interconnects for microfluidic systems. IEEE Trans. Adv. Packag. 26, 242-247 (2003).
  20. Lee, E., Howard, D., Liang, E., Collins, S., Smith, R. Removable tubing interconnects for glass-based micro-fluidic systems made using ECDM. J. Micromech. Microeng. 14, 535-541 (2004).
  21. Kua, C. H., Lam, Y. C., Yang, C., youcef-Toumi, K., Rodriguez, I. Modeling of dielectrophoretic force for moving dielectrophoresis electrodes. J. Electrostat. 66, 514-525 (2008).
  22. Saarela, V., et al. Re-usable multi-inlet PDMS fluidic connector. J. Sens. Actuators B Chem. 114, 552-557 (2006).
  23. Pattekar, A., Kothare, M. Novel microfluidic interconnectors for high temperature and pressure applications. J. Micromech. Microeng. 13, 337-345 (2003).
  24. Gray, B. L., et al. Novel interconnection technologies for integrated microfluidic systems. J. Sens. Actuators A Phys. 77, (1999).
  25. Miled, M. A., Sawan, M. Electrode robustness in artificial cerebrospinal fluid for dielectrophoresis-based LoC. IEEE Eng. Med. Biol. Conf. , 1390-1393 (2012).
High Throughput Microfluidic Rapid en Low Cost Prototyping Verpakking
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Miled, A., Sawan, M. High Throughput More

Miled, A., Sawan, M. High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods. J. Vis. Exp. (82), e50735, doi:10.3791/50735 (2013).

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