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JoVE Journal
Bioengineering

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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
 
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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Article DOI: 10.3791/50735
December 23rd, 2013

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Summary December 23rd, 2013

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In this article we describe different techniques for microfluidic rapid prototyping platforms. The proposed techniques are based on ultraviolet (UV) sensitive and temperature curing epoxies, polydimethylsiloxane (PDMS) based tubing, wire-bonding, and anisotropic adhesive films. The assembling procedures presented are developed for both one-time use devices as well as reusable microfluidic systems.

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