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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Article DOI: 10.3791/50735-v 07:51 min December 23rd, 2013
December 23rd, 2013



Please note that all translations are automatically generated.

Click here for the English version.

In this article we describe different techniques for microfluidic rapid prototyping platforms. The proposed techniques are based on ultraviolet (UV) sensitive and temperature curing epoxies, polydimethylsiloxane (PDMS) based tubing, wire-bonding, and anisotropic adhesive films. The assembling procedures presented are developed for both one-time use devices as well as reusable microfluidic systems.


High Throughput Microfluidic Rapid Low Cost Prototyping Packaging Methods One-time Use Reusable Packaging Techniques UV-based Curing Epoxies Temperature Curing Epoxies Microtubes Access Holes Wire-bonding Integrated Circuit Connections Silver Epoxy Electrical Connections Robust Assembly Technique High Pressure Psi Microfluidic Architecture PDMS-based Microtube Interconnectors Anisotropic Adhesive Films Plexiglas Support Sensitive Fragile Electrical Contact Micromanipulator Thin PDMS Layer Adherence Versus Injection Rates
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