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Lokalisierte Bathless Metal-Composite Plating via Electrostamping
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Lokalisierte Bathless Metal-Composite Plating via Electrostamping

Article DOI: 10.3791/61484-v • 08:05 min • September 22nd, 2020
September 22nd, 2020 •
*1, *1, *1, *2
1Department of Chemistry and Biochemistry, St. Mary's College of Maryland, 2PMA-265 Power and Propulsion IPTL
* These authors contributed equally

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Hier wird ein Protokoll der badelosen Galvanik vorgestellt, bei dem eine stagnierende Metallsalzpaste mit Verbundpartikeln zu Metallverbundwerkstoffen bei hoher Belastung reduziert wird. Diese Methode befasst sich mit den Herausforderungen anderer gängiger Formen der Galvanik (Jet, Pinsel, Bad) der Einbettung von Verbundpartikeln in die Metallmatrix.

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Chemie Ausgabe 163 Galvanik Elektrostempelung Badefrei Verbundwerkstoff Dünnschicht Beschichtung Trockenzelle hygroskopisch Beschichtung Nickel Phosphor Fluoreszenz Phosphoreszenz Metalloxide
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