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Lokalisert Bathless Metal-Kompositt Plating via Electrostamping
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Lokalisert Bathless Metal-Kompositt Plating via Electrostamping

Article DOI: 10.3791/61484-v • 08:05 min • September 22nd, 2020
September 22nd, 2020 •
*1, *1, *1, *2
1Department of Chemistry and Biochemistry, St. Mary's College of Maryland, 2PMA-265 Power and Propulsion IPTL
* These authors contributed equally

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Presentert her er en protokoll av badløs elektroplating, hvor en stillestående metall saltpasta som inneholder komposittpartikler reduseres for å danne metallkompositter ved høy belastning. Denne metoden løser utfordringene som andre vanlige former for galvanisering (jet, børste, bad) av å bygge inn komposittpartikler i metallmatrisen.

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Kjemi Utgave 163 Galvanisering Elektrostempling bathless kompositt tynn film belegg tørrcelle hygroskopisk plating nikkel fosfor fluorescens fosforescens metalloksider
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