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芯片尺寸支架的三维细胞培养的微细
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Article
DOI:
10.3791/699-v
•
09:37 min
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May 12th, 2008
芯片尺寸支架的三维细胞培养的微细
May 12th, 2008
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Stefan Giselbrecht1, Eric Gottwald1, Roman Truckenmueller2, Christina Trautmann3, Alexander Welle1, Andreas Guber4, Volker Saile4, Thomas Gietzelt5, Karl-Friedrich Weibezahn1
1Institute for Biological Interfaces, Karlsruhe Research Centre, 2Institute for BioMedical Technology, University of Twente, 3Department of Materials Research, Institute for Heavy Ion Research, 4Institute of Microstructure Technology, Karlsruhe Research Centre, 5Institute for Micro Process Engineering, Karlsruhe Research Centre
Chapters
Summary
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我们提出了两个过程的三维细胞培养的微细多孔聚合物芯片。第一个是与溶剂蒸气的焊接工艺相结合的热压。第二个使用最近开发microthermoforming过程中,结合离子跟踪技术,导致生产的一个显着简化。