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Brug synkrotronstråling Microtomography at undersøge Multi-skala Tre-dimensionelle Mikroelektroniske pakker
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Brug synkrotronstråling Microtomography at undersøge Multi-skala Tre-dimensionelle Mikroelektroniske pakker

Article DOI: 10.3791/53683-v • 08:46 min • April 13th, 2016
April 13th, 2016 •
1, 1, 2, 2, 2, 3, 3
1Materials Engineering Division, Lawrence Livermore National Laboratory, 2Assembly Test and Technology Development Failure Analysis Labs, Intel Corporation, 3Advanced Light Source, Lawrence Berkeley National Laboratory

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Til denne undersøgelse synkrotronstråling mikro-tomografi, en ikke-destruktiv tredimensional billeddannelse teknik, der anvendes til at undersøge en hel mikroelektroniske pakke med en tværsnitsareal på 16 x 16 mm. På grund af synkrotronen høje flux og lysstyrke prøven blev afbildet på bare 3 minutter med en 8,7 um rumlig opløsning.

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Engineering Synkrotronstråling mikro-tomografi røntgen imaging computertomografi ikke-destruktiv fejlanalyse bly gratis loddemateriale og tre-dimensionelle mikroelektroniske pakker
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