الليزر التي يسببها نقل إلى الأمام للرقي رقاقة التغليف وفاة واحدة

1:48

Micro-bumping Using Laser-induced Forward Transfer

3:52

Chip to Substrate Thermo-compression Bonding and Encapsulation of the Bonded Assembly

5:23

Characterization of the Bonded Vertical-cavity Surface-emitting Lasers

6:28

Results:A Typical Light-current-voltage Curve Recorded from a Flip-chip Bonded Vertical-cavity Surface-emitting Laser Chip

7:50

Conclusion