Why does patterned adhesive application reduce wicking time in paper microfluidic devices?

Patterned adhesive application increases the open area for fluid flow by minimizing adhesive coverage in non-channel regions, which decreases flow resistance and accelerates wicking. This effect is observed in both planar and nonplanar devices, where reduced adhesive area correlates with faster dye front progression. Improved wicking enhances device success rates by ensuring timely outlet filling under standardized testing conditions.

How does semi-permanent bonding from patterned adhesive support device disassembly after use?

Semi-permanent bonds formed through patterned adhesive application allow layers to be separated without tearing the paper substrate, enabling non-destructive disassembly. This contrasts with uniform adhesive application, which creates permanent bonds that destroy the device upon separation. The ability to disassemble devices facilitates post-use inspection and component reuse in iterative design cycles.

What quantitative measurement determines success in wicking tests for layered paper microfluidic devices?

Success is determined by the time required for all outlets to become completely filled with dye after inlet fluid deposition, with failure defined as incomplete filling or exceeding five minutes. This metric was used to compare 20 devices per condition under evaporation-controlled environments. Shorter wicking times and higher success rates were associated with patterned adhesive applied to both sides of the device.

Why does applying adhesive to only one side of a paper microfluidic device increase failure rates?

Single-sided adhesive application leads to incomplete layer adhesion, resulting in delamination or misalignment during fluid flow, which prevents dye from reaching outlets. Failures were characterized by outlets that either did not fill with dye or took longer than five minutes to fill. Dual-sided application ensures uniform bonding across layers, maintaining structural integrity and consistent fluidic performance.

How does increasing the border width around channels improve device success rates in origami-folded paper microfluidic devices?

Doubling the border width around channels reduces the likelihood of unintended adhesive bonding between unrelated faces during folding, which can block fluid pathways. This design adjustment increases success rates for both single and double-sided adhesive applications by minimizing false bonding in crease regions. The improvement was demonstrated in origami peacock devices where crease-adjacent outlets previously failed to fill with dye.

Wykorzystanie wzoru kleju do budowy urządzeń mikroprzepływowych z papieru 3D

7.3K wyświetleń

Cytowany 4 razy

07:53 min

1 kwietnia 2016

10.3791/53805-v

1 kwietnia 2016

7.3K wyświetleń

Brent Kalish¹ , Hideaki Tsutsui¹^,²^,³

¹Department of Mechanical Engineering, University of California, Riverside, ²Department of Bioengineering, University of California, Riverside, ³Stem Cell Center, University of California, Riverside

Pokazujemy użycie wzorzystych klejów aerozolowych do budowy 3D papierowych urządzeń mikroprzepływowych. Ta metoda nakładania kleju tworzy półtrwałe wiązania między warstwami, umożliwiając nieniszczący demontaż urządzeń jednorazowego użytku po użyciu i ułatwiając składanie złożonych struktur niepłaskich.