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Method Article

Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing

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DOI:

10.3791/53276

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November 9th, 2015

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In This Article

Summary

A viable transfer printing-based methodology to introduce plasmonic metal nanostructures in solar cells is described. Using nanopillar poly(dimethylsiloxane) stamps, an Ag-based ordered nanodisk array was integrated with standard hydrogenated microcrystalline Si solar cells, which led to improved device performances due to plasmonic light trapping.

Abstract

One of the potential applications of metal nanostructures is light trapping in solar cells, where unique optical properties of nanosized metals, commonly known as plasmonic effects, play an important role. Research in this field has, however, been impeded owing to the difficulty of fabricating devices containing the desired functional metal nanostructures. In order to provide a viable strategy to this issue, we herein show a transfer printing-based approach that allows the quick and low-cost integration of designed metal nanostructures with a variety of device architectures, including solar cells. Nanopillar poly(dimethylsiloxane) (PDMS) stamps were fabricated from a commercially available nanohole plastic film as a master mold. On this nanopatterned PDMS stamps, Ag films were deposited, which were then transfer-printed onto block copolymer (binding layer)-coated hydrogenated microcrystalline Si (µc-Si:H) surface to afford ordered Ag nanodisk structures. It was confirmed that the resulting Ag nanodisk-incorporated µc-Si:H solar cells show higher performances compared to a cell without the transfer-printed Ag nanodisks, thanks to plasmonic light trapping effect derived from the Ag nanodisks. Because of the simplicity and versatility, further device application would also be feasible thorough this approach.

Introduction

There has been a long-standing demand for the application of functional nanostructures in a broad range of technological field. One of the expectations for this trend is to open new design of device architectures leading to improved or innovative performances. In the field of solar cells, for example, the use of metal nanostructures has been actively explored because of their intriguing optical (i.e., plasmonic) properties,1 potentially beneficial to construct effective light trapping systems.2,3 Indeed, some theoretical studies4-6 have suggested that such plasmonic light trapping could achieve effects exceeding the convention....

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Protocol

1. Preparation of PDMS Stamps

  1. Set a nanohole mold (nanoimprinted cyclo olefin polymer plastic film, size: 50 mm × 50 mm) in a polytetrafluoroethylene (PTFE) container.
  2. Weigh vinylmethylsiloxane-dimethylsiloxane copolymer (0.76 g for the 50 mm × 50 mm mold) in a disposable glass bottle and mix it with Pt-divinyltetramethyldisiloxane complex (6 µl, using a digital micro pipette with a disposable polypropylene tip) and 2,4,6,8-tetramethyltetra-vinylcyclotetrasiloxane (24 µl, using a digital micro pipette with a disposable polypropylene tip).
  3. Add methylhydrosiloxane-dimethylsiloxane copolymer (0.24 ml, using a digital mi....

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Results

Figure 2 outlines the general process for the transfer printing of Ag nanodisks on the surface of µc-Si:H (n layer). Briefly, an Ag film (thickness: 10-80 nm) is first deposited on the surface of a nanopillar PDMS stamp by electron beam evaporation. In parallel, a PS-b-P2VP solution is spin-coated on the surface of a freshly prepared µc-Si:H n layer. Subsequently, a droplet of EtOH is placed on the PS-b-P2VP-coated surface, and the Ag-deposited PDMS stamp is placed on .......

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Discussion

In this article, a double-layered hard/soft PDMS composite was employed as stamp materials.27 This combination was found to be essential to precisely replicate the parent nanostructure in the mold, which was a hexagonally close-packed round-hole array whose diameter of 230 nm, depth of 500 nm, and hole center-to-center spacing of 460 nm. When only soft PDMS was used, the stamp always resulted in a poorly nanostructured surface (for example, no sharp edge in the inverted pillar structure) due to the low Young&#.......

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Disclosures

The authors have nothing to disclose.

Acknowledgements

The authors thank New Energy and Industrial Technology Development Organization (NEDO) under Ministry of Economy, Trade, and Industry (METI), Japan, for the financial support.

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Materials

List of materials used in this article
NameCompanyCatalog NumberComments
Nanohole moldScivaxFLH230/500-120
PTFE containerEishinn/aCustom made
Hard-PDMS materials
Vinylmethylsiloxane-dimethylsiloxane copolymerGelestVDT-731
 Pt-divinyltetramethyldisiloxane complexGelestSIP6831.1
Methylhydrosiloxane-dimethylsiloxane copolymerGelestHMS-301
2,4,6,8-tetramethyltetra-vinylcyclotetrasiloxaneSigma-Aldrich396281Additive for hard-PDMS
Soft-PDMS materialsDow CorningSylgard-184Silicone precursor
PS-b-P2VPPolymer SourceP5742-S2VPMn × 103 = 133-b-132
Glass/SnO2:F substratesAsahi Glass Co. Ltd.Type VUChemical mechanical polished by D-process Inc. (http://d-process.jp/index.html) to flatten the surfaces
DetergentFruuchi Chemical Co.
http://www.furuchi.co.jp/eng/main.htm
Semico-clean 56Used for the cleaning of Glass/SnO2:F substrates
ZnO:Ga supputtering targetAGC Ceramics Co. Ltd.5.7GZO
Ag supputtering targetMitsubishi Materials Co.4NAg
Double-sided adhesive tapeNisshin EM Co.732
Polyimide tapeDupontKapton 650S#25
Sn-Zn-based SolderKuroda Techno Co., Ltd.Cerasolzer AL-200
Digital micro pipetteNichiryo00-NPX2-20
00-NPX2-200
00-NPX2-1000
Heating chamberTokyo Rikakikai Co., Ltd.VOS-201SD
Electron beam evaporatorCanon-Anelvan/aCustom made
Electron beam evaporatorAriosn/aCustom made
Sputtering systemUlvacSBR-2306
PECVD systemShimadzu Emit Co. Ltd.SLCM-13
Ar plasma systemDiner Electric GmbhFemto
RIE systemSamco Inc.RIE-10NR
Ultrasonic soldering deviceColby-Eishin Enterprises, Inc.SUNBONDER
EQE measurement systemBunkoukeiki Co. Ltd.CEP-25BXS
J-V characteristics measurement systemBunkoukeiki Co. Ltd.OTENTOSUN-5S-I/V
Amorphous Si reference cellBunkoukeiki Co. Ltd.WPVS-NPB-S1For light intensity calibration
Digital multi-meterKeithley Instruments Inc.2400

References

  1. Murray, W. A., Barns, W. L. Plasmonic Materials. Adv. Mater. 19, 3771-3782 (2007).
  2. Atwater, H. A., Polman, A. Plasmonics for improved photovoltaic devices. Nat. Mater. 9, 205-213 (2010).
  3. Green, M. A., Pillai, S.

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