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Micropumps can drive liquid flow on a much smaller scale than most pumps. In recent years, various driving schemes have been applied successfully to microfluidic systems1,2,3,4,5. The electrohydrodynamic (EHD) pump can exert forces directly on the liquid, without any moving parts, which makes it simpler and easier to fabricate6. According to the charge types, EHD pumps can be classified as injection pumps, induction pumps, or conduction pumps. Induction pumps do not work on isothermal liquids, while injection pumps change the liquid conductivity. Because they lack such problems, conduction pumps are more stable and have a wider application.
The conduction pump is based on the mismatch of the dissociation and recombination rates of liquid molecules. Normally, the dissociation and recombination process can be expressed as follows7,8:

where the recombination rate kr is constant while the dissociation rate kd is a function of the electric field strength. When the electric field strength reaches a certain value, the dissociation rate will exceed the recombination rate. Then, more and more free charges travel to the two electrodes of opposite polarity, and heterocharge layers form. These heterocharge layers are the key to the pump, as the movement of the charges pushes the liquid molecules forward. Therefore, net body force can be generated in the liquid within the chamber using asymmetric electrodes or the mismatch of the mobility of positive and negative ions9,10,11,12.
This work introduces a new way of fabricating a symmetric planar electrode plate for a conduction pump. The electrode plate is prepared on FR-4 CCL, and the pump chamber is prepared by micromachining. The fabrication processes are relatively simpler and more convenient than those of other manufacturing methods, such as nanolithography. A testing platform is set up to investigate the performance of the conduction micropump under different conditions. Furthermore, the reliability of the conduction micropump is also investigated under different circumstances.