Scalable Stamp Printing and Fabrication of Hemiwicking Surfaces

Summary

A simple protocol is provided for the fabrication of hemiwicking structures of varying sizes, shapes, and materials. The protocol uses a combination of physical stamping, PDMS molding, and thin-film surface modifications via common materials deposition techniques.

Abstract

Hemiwicking is a process where a fluid wets a patterned surface beyond its normal wetting length due to a combination of capillary action and imbibition. This wetting phenomenon is important in many technical fields ranging from physiology to aerospace engineering. Currently, several different techniques exist for fabricating hemiwicking structures. These conventional methods, however, are often time consuming and are difficult to scale-up for large areas or are difficult to customize for specific, nonhomogeneous patterning geometries. The presented protocol provides researchers with a simple, scalable, and cost-effective method for fabricating micro-patterned hemiwicking surfaces. The method fabricates wicking structures through the use of stamp printing, polydimethylsiloxane (PDMS) molding, and thin-film surface coatings. The protocol is demonstrated for hemiwicking with ethanol on PDMS micropillar arrays coated with a 70 nm thick aluminum thin-film.

Introduction

Recently there has been increased interest in being able to both actively and passively control the wetting, evaporation, and mixing of fluids. Uniquely textured hemiwicking surfaces provide a novel solution for cooling techniques because these textured surfaces act as a fluid (and/or heat) pump without the moving parts. This fluid motion is driven by a cascade of capillary action events associated with the dynamic curvature of the liquid thin-film. In general, when a fluid wets a solid surface, a curved liquid thin-film (i.e., liquid meniscus) rapidly forms. The fluid thickness and curvature profile evolve until a free-energy minimum is reached. For reference, this dynamic wetting profile can rapidly decay to tens of nanometers in thickness within a spanning (fluid-wetting) length-scale of only tens of micrometers. Thus, this transitional (liquid-film) region can undergo significant changes in liquid-interface curvature. The transitional (thin-film) region is where nearly all the dynamic physics and chemistry originates. In particular, the transitional (thin-film) region is where maximum (1) evaporation rates, (2) dis-joining pressure gradients, and (3) hydrostatic pressure gradients are found^1,2. As a result, curved liquid-films play a vital role in thermal transport, phase separation, fluid instabilities, and the mixing of multi-component fluids. For instance, with respect to heat transfer, the highest wall heat fluxes have been observed in this highly curved, transitional thin-film region^3,4,5,6,7.

Recent hemiwicking studies have shown that the geometry (e.g., height, diameter, etc.) and placement of the pillars determine the wetting front profile and velocity of the fluid running through the structures⁸. As the fluid front is evaporating off the end of the last structure in an array, the fluid front is maintained at a constant distance and curvature, as the evaporated fluid is being replaced by the fluid stored in the wicking structures⁹. Hemiwicking structures have also been used in heat pipes and on boiling surfaces to analyze and enhance different heat transfer mechanisms.^10,11,12.

One method currently used to create wicking structures is thermal imprint lithography¹³. This method is performed by stamping the desired layout into a resist layer on a silicon mold sample with a thermoplastic polymer stamp, then removing the stamp to maintain the microstructures. Once removed, the sample is put through a reactive ion etching process to remove any of the excess resist layer^14,15. This process, however, can be sensitive to the temperature of the fabrication of the wicking structures and includes multiple steps that utilize various coatings to ensure the accuracy of the wicking structures¹⁶. It is also the case that lithography techniques are not practical for macro-scale patterning; while they still provide a way to create a pattern of microstructures on a surface, the throughput of this procedure is far less than ideal for large-scale reproduction. Considering large-scale, reproducible texturing, such as spin or dip coating, there is an inherent lack of controllable patterning. These methods create a random array of microstructures on the target surface but can be scaled to cover vastly larger areas than traditional lithography techniques¹⁷.

The protocol outlined within this report attempts to combine the strengths of traditional texturing methods while simultaneously eliminating the specific weaknesses of each; it defines a way to fabricate custom hemiwicking structures of various heights, shapes, orientations, and materials on a macro-scale and with potentially high throughput. Various wicking patterns can be quickly created for the purpose of optimization of wicking characteristics, such as directional control of fluid velocity, propagation, and mixing of different fluids. The use of different wicking structures can also provide varying thin-film thickness and curvature profiles, which can be used to systematically study the coupling between heat and mass transfer with different thickness and curvature profiles of the liquid meniscus.

Protocol

1. Create the Patterning Map

1. Using a graphics editor, create the desired pattern for the hemiwicking structures represented as a bitmap image.
   NOTE: Some of the wicking design parameters (i.e., angle gradient, depth gradient) can be made to be dependent on the grayscale values assigned to each pixel. These grayscale values are then edited in order to modify the desired parameter.
2. Save the bitmap as a portable network graphic (.png) and place the file in a readily available folder.

2. Placing the Plastic to be Stamped for Molding

1. Begin by translating the stamping bit away from the workspace to avoid any accidental contact that may cause breakage of the tip (+z displacement, Figure 1).
2. Secure the plastic stamping mold/wafer to a backing plate for subsequent stamping on the x, y translation stage (see Figure 1). Secure the sample/backing plate on to the x, y motorized stamping stage (Figure 1)
3. Align the center of the plastic mold/wafer with the stamping axis of the stamping bit. This is accomplished via computerized ±x and ±y displacements with the x, y motorized stamping stage.
4. Translate the stamping bit towards the plastic mold/wafer (-z displacement, Figure 1) until the stamping bit is almost in contact with the mold/wafer surface.

3. Stamping the Plastic Sample for PDMS Molding

1. Using the computerized stamping control program, set the distance between the stamping bit (tip) and the plastic mold/wafer surface.
2. Translate the stamping bit in small increments (-δz displacement, Figure 1) towards the surface of the sample until the tooling is in contact with the plastic.
   NOTE: The bit should only lightly contact the surface.
3. After contact, translate the stamping bit away from the sample to avoid any possible contact between the bit and sample during subsequent translation (δz ≈ 100 μm).
4. Assign a pixel distance (in micron), maximum and minimum cavity depth (in micron), maximum and minimum angle (in degrees), initial x and y pixel position of the pattern, and pixel threshold for any gray-scale linked patterning for the stamping procedure.
5. Upload the patterning map (created in step 1.1) to be read by the program. Based on the pixel distance and the patterning map, the locations of all the stamps are sent to the stepper motors.
6. Ensure that the heating laser is focused on the tip of the stamping bit and only activates while the stamping bit is moving toward and into the plastic mold.
7. Create the cavities by pressing the bit into the plastic while following the patterning map to achieve the desired hemiwicking pattern.
8. Remove the stamped plastic mold for subsequent surface refinishing and polishing.
9. Polish the surface of the plastic mold using 9000 grit, finer wet/dry sandpaper.
   NOTE: Alternatively, micro-mesh abrasive can be used to ensure the removal of surface deposits that cause cratering around the pillars in the PDMS mold.

4. Create the PDMS Molding

1. Pour 2 g of elastomer base and 0.2 g of the elastomer curing agent into a beaker and mix together thoroughly for 3 min.
2. Place the mixture into an evacuated chamber to release any air bubbles caught in the mixture; this step may need to be repeated multiple times.
   NOTE: For samples of varying volume requirements, adjust the amount of base and curing agent as needed while maintaining a 10:1 ratio.
3. Place the stamped plastic mold into a walled container, ideally not much larger than the outer diameter of the mold, for the curing to occur.
4. Pour the PDMS mixture free of air pockets onto the stamped plastic and within the container. Pour in a spiral, starting from the center of the stamped area, to attempt to distribute the PDMS mixture as equally as possible.
5. Repeat step 4.2 for any air pockets that may have formed from pouring the mixture onto the stamped pattern. Place the PDMS mixture and plastic piece with stamped pattern onto a hot plate and heat the assembly at 100 °C for 15 min. Then heat an additional 25 min at 65 °C.
6. Allow the PDMS mixture to cool and cure for 20 min before handling.
7. Cut the edges of the PDMS plastic away from the container wall and remove the PDMS plastic from the mold. Store the PDMS plastic in a covered container to avoid dust particles from collecting on the surface.

5. Depositing the Thin-Film Metal on the PDMS

1. Place the sample PDMS inside the deposition chamber leaving enough space for the shutter to be opened and closed unobstructed.
2. Depressurize the deposition chamber to at least 10 mTorr.
3. Engage the dry pump system and set the spin rate to 75 kRPM. Allow chamber to reach a pressure on the order of 10^-8 Torr.
   NOTE: This will remove most contaminants from the chamber; process may take up to 12 h to complete.
4. Power on the cooler and DC power supply and set the power to 55 W.
5. Open the argon valve slightly and pressurize the chamber to the order of 10^-3 Torr. Set the dry pump system 50 kRPM and wait until this set speed is achieved.
6. Reduce power to 35 W and depressurize the chamber to 13 mTorr. Open the shutter to ignited plasma and start the timer.
   NOTE: Ignited plasma should give off a blue, incandescent glow. Timer should be set for desired thickness of film deposit. It has been determined that for 35 W and pressure of approximately 13 mTorr, a rate of 7 nm deposition per minute is expected.
7. Once the desired film thickness has been achieved, close the shutter and turn off power supply.
8. Close all of the valves within the deposition chamber and turn off the dry pump system. Allow time for the dry-pump fan to come to a complete stop.
9. Slowly pressurize the chamber until it reaches local atmospheric pressure and remove the sample, storing it for future experiments.

Results

Figure 1 provides a schematic of how the stamping mechanism would create the mold for the wicking structures on a plastic mold. To investigate the quality of the stamping apparatus in manufacturing wicking films, two different pillar arrays were created to analyze the quality of the pillars for future wicking experiments. Aspects of the apparatus investigated were the accuracy of the height of the pillars (with and without a depth gradient), the quality of th...

Discussion

A method has been introduced to create patterned pillar arrays for hemiwicking structures; this is accomplished by imprinting cavities on a plastic wafer with an engraving apparatus that follows patterning from a bitmap created by the user. A PDMS mixture is then poured, cured and coated with a thin film of aluminum via deposition. The pillar array characteristics can be customized depending on the gray scale value that is assigned in the bitmap following this protocol. This crucial aspect of patterning can crea...

Materials

List of materials used in this article

Name	Company	Catalog Number	Comments
NI-DAQ 9403	National Instruments	370466AE-01	The communication interface between the camera and the control switch for the laser.
Control Switch	Crouzet	GN84134750	A controller to use for the laser that activates the laser based on the voltage sent by the DAQ.
Flea Camera	FLIR	FL3-U3-120S3C-C	A flea camera used for imaging the drill bit on the plastic mold.
Flea Imaging Camera	Point Grey	FL3-U3-20E4M-C	A flea camera used for obtaining the side images of the pillars.
200 Steps/rev, 12V-350mA Stepper Motor (x2)	AdaFruit	324	The stepper motors are used to control the depth and angle of the end mill.
10x Infinity Corrected Long Working Distance Objective	Mitutoyo	#46-144	The objective used to get the image of the side of the pillars.
15x Infinite Conjugate, UV Coated, ReflX Objective	TechSpec	#58-417	The objective used to get the image of the top of the pillars.
72002 0.002D X 0.006 LOC Carbide SQ 2FL Miniature End Mill	Harvey Tools	72002	The drill bit that was used to create holes in the plastic mold.
DC Power Delivery at 1 kW	Advanced Energy	MDX-1K	Used to power the deposition sputterer.
Turbo-V 70LP Nacro Torr Pump	Varian	9699336	Turbo Pump used to reduce pressure inside deposition chamber.
2000mw, 405nm High-Power Blue Light Focus Laser	WDLasers	KREE	Sample Heating Laser
5.875" I.D. Dessicator w/ 0.25" Tube Connections	McMaster-Carr	2204K5	PDMS Dessicator
SYLGARD 184 Silicone Elastomer, 0.5kg Kit	Dow-Corning	4019862	The PDMS Kit used to make the base.
Diaphragm Air Compressor / Vacuum Pump	Gast	DOL-701-AA	Dessicator Vacuum Pump
Motorized Linear Stages (2x)	Standa	8MT175	The stepper motors used to control the sample plate in the x- and y- direction.
2" Diameter Unmounted Poistive Achromatic Doublets, AR Coated: 400-700 nm	ThorLabs	AC508-150-A	The achromat was ued in order to obtain the images of the side of the pillars.
Flea 3 Mono  Camera, 2448 X 2048 Pixels	Point Grey	FL3-GE-50S5M-C	A flea camera used for imiaging the top of the pillars.
Digital Vacuum Transducer	Thyrcont Vacuum Instruments	4940-CF-212734	Used for monitoring pressure inside deposition chamber.
Pressurized Argon Tank Resovoir	Airgas	AR RP300	Gas used in deposition process.
1-D Translation Stage	Newport Corporation	TSX-1D	A translation stage used to move the camera to focus on the end mill.
Cylindrical Laser Mount (x2)	Newport Corporation	ULM-TILT-M	The laser mount was used to move the camera to focus on the end mill.
Benchtop Chiller with Centrifugal Pump, 120V, 60Hz	Polyscience	LS51MX1A110C	A chiller used for the deposition assembly.
Alcatel Adixen 2010SD XP, Explosion Proof Motor, Rotary Vane Vacuum Pump, 1-Phase	Ideal Vacuum Products	210SDMLAM-XP	A vacuum pump used for the deposition assembly.
Fan, 105 CFM, 115 V (x2)	Comair Rotron	MU2A1	A fan used for cooling certain aspects of the deposition assembly.