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Once the power circuit, power supply, power switch, the POTs, and an LED is assembled (up to Supplementary Figure 21), the circuit can be tested. With all the POTs in place, the POT will control the LED intensity. Once assembly is completed up to Supplementary Figure 29, the system can be used manually for optogenetics or other applications. The entire system power can be manually controlled with the power switch. The intensity of each LED can be controlled independently using the POT connected to each circuit.
After installing the software and programming the microcontroller, the user interface can communicate with the microcontroller. With the user interface, the LEDs can be controlled temporally in several ways: (1) each LED can be programmed to stay on for a specified time, (2) each LED can be programmed to pulse, (3) a global start delay (e.g., when transfecting and shining light 24 h later) can be programmed (Figure 6B), (4) the total time for the program to run after the delay. There are two User Interfaces, one with larger buttons that can control two LEDs at a time and another that can control four LEDs (Figure 5A,B). The two LED User Interface is optimized for tablets and is sufficient to control red and far-red LEDs for many experiments.
For larger experiments, the second user interface can be used to control up to four LEDs. When inducing gene expression, the anticipated result depends on several parameters. These include induction time, induction levels (e.g., amount of light or drug), and copy number of the inducible construct in the cell. To show this, we transfected the PhyB gene switch along with different amounts of reporter DNA (pPK-202) (0.5%, 1%, 2%, 4%, and 8% of the transfected DNA) (Figure 6A) and illuminated as shown in Figure 6B. In samples containing PhyB, but no plasmid to produce phycocyanobilin (PCB-chromophore) (i.e., unresponsive to light), luciferase gene expression/leakiness increases with the amount of reporter DNA (Figure 6C) (Far-red P < 0.0001, Linear regression followed by a Wald test), (Red P < 0.0001, Linear regression followed by a Wald test). In addition, when the entire PhyB gene switch, including the PCB-chromophore producing plasmid (light-sensitive cells), are illuminated for Far-red light, Luciferase expression also increases with the increasing reporter construct amounts in the transfection mix (Figure 6C,D) (Far-red light P < 0.0001, Linear regression followed by a Wald test). Similarly, when the light-sensitive cells are illuminated with red light, luciferase expression also increases with increased reporter amount (P < 0.0001, Linear regression followed by a Wald test). When comparing induction levels of the red light treated cells to the far-red light treated cells, we found a small decrease in the fold activation with increasing reporter amount (Figure 6E) (P = 0.0141, Linear regression followed by a Wald test).

Figure 1: A basic circuit for a single LED. (A) A flow chart showing an overview of the steps needed to build the LED illumination system. (B) The LED illumination control system. (left) Control box for regulating LED intensity and timing. (middle) A PC tablet running user interface for controlling LEDs. (right) A black box for mounting LEDs and placing cells for optical stimulation. (C) Table for determining whether the LED requires a high or low voltage circuit. Please click here to view a larger version of this figure.

Figure 2: Instructions for soldering the components into place. (A) An example of the step-by-step cartoon instructions for building the circuit. (B,C) Example instructions with pictures of the device being assembled. (D) Example instructions for assembling multiple circuits simultaneously. Please click here to view a larger version of this figure.

Figure 3: Views of an assembled LED control system. (A) A top outside view of the assembled system. (B) An inside view of an assembled four LED illumination system. Please click here to view a larger version of this figure.

Figure 4: Instructions for reflow soldering the LED onto the heat sink. (A) The LED base and a close up of a deep red LED. (B) Placement of solder paste onto the LED base. (C) Picture of soldered LED. Red arrows point to soldering pads. Compared to gray before soldering (A), after soldering, the solder appears metallic/shiny. Please click here to view a larger version of this figure.

Figure 5: Software for controlling optogenetic experiments. (A) A two LED user interface with large buttons for easy use with an inexpensive tablet. (B) A four LED User Interface. Both interfaces allow independent LED control. For pulsing, LEDs can be programmed to turn on and off for specific pulse widths and specified durations. The pulsing can also have a start delay and a predetermined total run time. (C) The LED control tablet mounted onto a cell culture incubator. (D) Illustration of the PhyB gene system when illuminated with far-red light. Far-red light keeps the gene in the “off” or “dark” state. (E) Illustration of the PhyB gene system when illuminated with red light. Red light induces gene expression by promoting the interaction between PhyB and PIF3. This interaction localizes the gene activation domain (AD) fused to PIF3 to the UAS promoter, activating the reporter gene. Please click here to view a larger version of this figure.

Figure 6: Anticipated results using the LED system to control PhyB. (A) A plasmid encoding PhyB+PIF3 two-hybrid partners (pPK-351), a plasmid encoding phycocyanobilin (PCB-chromophore) synthesis enzymes (pPK-352), and a Luciferase reporter plasmid (pPK-202). (B) Timeline of light induction experiments for C–E. (C) Basal transcription levels (AKA leakiness) with increasing amounts of reporter DNA. “Leak” samples are not transfected with pPK-352 (i.e., unresponsive to light), but are illuminated with red or far-red light. Light Switch (LS) samples include all light-gene switch plasmids and are illuminated with red or far-red light. (D) Light induction levels in response to red and far-red light. (LS-Far-red light is the same data in C and D.) (E) Fold induction of luciferase in cells illuminated with red light/far-red light. Please click here to view a larger version of this figure.
Please click here to download Supplementary Figures 1-39.
Supplementary Figure 1: Electronic Driver Circuit for multiple LEDs. (A) The circuit diagram for a single LED system. (B) The circuit diagram for a four LED system.
Supplementary Figure 2: Placing the circuit Interconnections. (A) Clip your PCB board onto your helping hands. (B) Position of main circuit jumpers into the through holes in the picture. (C) Diagram of wire connectors mapping the coordinates. For the four LED systems, draw lines dividing each circuit as shown (black vertical lines). Supplementary Figure 31–38 describe the assembly of four circuits simultaneously.
Supplementary Figure 3: Soldering the wires onto the PCB. (A) Bend jumpers so that they make direct contact with the PCB and stay in place while soldering. (B) Another view of the bent wires. (C) Wires after soldering. (D) Trimmed wires on the PCB. (E) Shrunken insulation after heating with solder. (F) Moving the insulation into position to cover the ground through-hole (blue arrow) (G) Adding flux to a wire end or terminal.
Supplementary Figure 4: Soldering the voltage regulator into place. (A) Map of the voltage regulator coordinates. (B) Placement of the voltage regulator. (C) Bent voltage regulator leads. (D) Voltage regulator terminals after soldering.
Supplementary Figure 5: Soldering the R1 resistor into place. (A) Map of the R1 resistor (820Ω) coordinates. (B) Pulling the resistor through by the lead using pliers (C) The pulled resistor close to PCB. (D) The soldered resistor close to PCB.
Supplementary Figure 6: Soldering the transistor into place. (A) Map of the transistor coordinates and orientation. (B) Note the orientation of the transistor; the label in this model is facing the voltage regulator (LM317T). Double-check the specification of the transistor to make sure the “Emitter”, “Base”, and “Collector” are in the correct holes. (C) The transistor with the terminals bent before soldering.
Supplementary Figure 7: Soldering the wire-to-wire connector for the potentiometer into place (plus a 560Ω resistor for the low voltage circuit). (A) Map of the coordinates of the wire-to-wire connector (plus the R3-560Ω if building the low voltage circuit, the wire-to-wire connector is placed in the hole before the resistor). (B) A female wire-to-wire connector. (C) To facilitate fitting the resistor and the wire-to-wire connector into the through-hole, 3–5 strands of the braided wire are bent. (D) The strands are cut off with wire cutters as close to the insulation as possible. (E) Inserted red wire of a female wire-to-wire connector through the a5 through hole (for the low voltage circuit insert R3 through the same through hole). (F) Underside view of the resistor and wire-to-wire connector before soldering. (G) Image of the soldered R3 resistor connected to the ground (F = Female).
Supplementary Figure 8: Soldering the wire-to-wire connector for the potentiometer to the ground. (A) Map of the coordinates of the ground connection for the potentiometer wire-to-wire connector. (B) Top view of the potentiometer wire-to-wire connector in parallel with R3 (F = Female).
Supplementary Figure 9: Soldering the microcontroller and LED wire-to-wire connectors. (A) Map of the coordinates of the wire-to-wire connector for connecting the 2N222A and the ground to the microcontroller. (B) Soldered male wire-to-wire connector. (C) Top view of (B). (D) Map of the female wire-to-wire connector coordinates for connecting the input of the circuit and ground to the LED. (E) Soldered female wire-to-wire connector (F = Female, M = Male).
Supplementary Figure 10: Soldering the jumper for the power supply circuit. (A) Map of the coordinates of the orange jumper for connecting the power supply to the ground. (B) The orange jumper soldered in place. (C) The underside view of the jumper soldered in place.
Supplementary Figure 11: Soldering the power switch and power source wire-to-wire connectors. (A) Map of the coordinates of the female wire-to-wire connector for connecting the power switch. (B) The female wire-to-wire connector soldered in place. (C) Another view of (B). (D) Map of the coordinates of the male wire-to-wire connector for connecting the power source. (E) Soldered male wire-to-wire connector. (F) Another view of (E) (F = Female, M = Male).
Supplementary Figure 12: Connecting the power supply to a male wire-to-wire connector. (A) The unmodified power supply. (B) Cutting off the power supply wires. (C) The power supply wires stripped and with excess insulation cut away. (D) Placement of shrink tube around power supply wires. Tubing separating the two connections (red arrows) and tubing to hold the separated wires (yellow arrow). (E) Twisted wires connecting the power supply to the female wire-to-wire connector.
Supplementary Figure 13: Soldering and insulating the power supply connection to a male wire-to-wire connector. (A) The soldered connection between the power supply ground and a female wire-to-wire connector. (B) The soldered connection between the positive terminal of the power supply and a female wire-to-wire connector. (C) Shrink tube pulled over the soldered individual connections (red arrow). (D) Both power supply connections soldered and with heat-treated shrink tube. (E) Placement of shrink tube over individual connections (yellow arrow). (F) Completed power supply.
Supplementary Figure 14: Soldering the power switch to a male wire-to-wire connector. (A) Power switch with stripped wires and shrink tube placed over the wires (red arrows). (B) Wires connecting the switch and male wire-to-wire connector twisted together before soldering. (C) Placing the shrink tube over the soldered connections. (D) Connections covered with the heat-treated shrink tube. (E) A power switch assembled with a male wire-to-wire connector.
Supplementary Figure 15: Wiring a potentiometer to a male wire-to-wire connector. (A) The potentiometer parts. (B) A male wire-to-wire connector twisted and bent to hook around the middle terminal of the potentiometer. (C) A male wire-to-wire connector twisted around the middle terminal of the potentiometer. (D) Soldered wire-to-wire connections. (E) Red arrow pointing to the metal tab before removal. (F) The potentiometer after metal tab removal.
Supplementary Figure 16: Wiring the microcontroller connection. (A) Wires for female wire-to-wire connectors stripped and cut in preparation for crimping. (B) Placement of the crimp on the wire-to-wire connector. (C) Crimping of the wire-to-wire connector. (D) Crimped wire-to-wire connector. (E) Fully assembled microcontroller connection.
Supplementary Figure 17: Soldering wires and LED onto the LED base Part 1. (A) Materials needed to solder the LED to the LED base. (B) Tinning the tip of the stripped wire. (C) Applying flux onto the contact of the LED base. (D) Adding solder to the large soldering tip to tinning the LED base. (E) Placement of solder onto the contact to heat the LED base. (F) The LED base after dragging the soldering tip across the contact. (G) The same procedure on the other contact.
Supplementary Figure 18: Soldering wires and LED onto the LED base Part 2. (A) A tinned wire clipped to the contact using a hair clip. Note that the black wire is soldered to the cathode “C-”. (B) Addition of a generous amount of solder to the soldering tip. (C) The soldering tip pressing down on the wire, melting the solder on the LED base and the wire. (D) Holding down the wire so that it stays put when the soldering iron is removed. (E) Holding the wire in place until the solder hardens.
Supplementary Figure 19: Soldering wires and LED onto the LED base Part 3. (A) Using a sharp tip to place solder paste onto the LED base for mounting the LED. (B) The LED base with the soldering paste in place. (C) Placement of the LED onto the LED base such that the contacts of the LED and LED base match.
Supplementary Figure 20: Soldering wires and LED onto the LED base Part 4. (A) The black wire still clipped to the contact by the hair clip. (B,C) Using a second hair clip, the red wire is held into place. Note that the red wire is soldered to the anode “A+”. (D) Addition of a generous amount of solder to the soldering tip. (E) The soldering tip pressing down on the wire, melting the solder on the LED base and the wire as well as the solder paste under the LED. (F) The hot LED base cooling after soldering. (G) The LED base with the wires and LED soldered on. (H,I) Red arrows point to soldering pads. After soldering, the solder appears metallic/shiny (compared to gray before soldering (Supplementary Figure 16D)).
Supplementary Figure 21: Connecting the LED wire to a male wire-to-wire connector. (A) Stripped wires and male wire-to-wire connector next to the shrink tube cut in half (1/8 inch and 3/16 inch). (B) Shrink tube placement over the wires before soldering. (C) Wires twisted together before soldering. (D) The soldered connection from the wire to the wire-to-wire connector. (E) Both the red and black wires soldered together. (F) Placement of the 1/8 inch shrink tube over the soldered connection. (G) The shrink tube after shrinking with the heat gun. (H) Placement of the 3/16 inch shrink tube over the smaller shrink tube. (I) The connection soldered and sealed with the shrink tube.
Supplementary Figure 22: Securing the wires and LEDs to the LED base using epoxy. (A) Using a wooden applicator to place epoxy into the LED base. A tape is placed below to catch any dripping epoxy. (B) Epoxy is spread evenly over the entire surface. (C) The LED is left overnight to cure.
Supplementary Figure 23: Mounting LEDs inside a box lid. (A) An LED with a touch fastener piece attached for easy mounting. (B) Different color LEDs mounted on the inside of a black box using a touch fastener. (C) A notch on the black box's lid made by a high-speed rotary tool to make room for the LED wire. (D) A black box for stimulating the cells with touch fasteners for mounting the LED. (E) Placement of a multiwell dish inside of the touch fastener version of the LED box.
Supplementary Figure 24: Mounting LEDs outside a box lid. (A) Hole drilled into the black box's lid with a notch from the high-speed rotary tool to make room for the wire (red arrow). (B) LED placed into the hole with the wire in the notch, held in place with electrical tape. (C) Two more pieces of tape are used to secure the LED. The backside of the heat sink is exposed to maximize heat exchange. (D) Privacy film taped over the hole where the LED will be placed. The red arrow points to the privacy film. (E) A black box for stimulating the cells with an LED mounted outside the box and with privacy film for diffusing the illumination. (F) Placement of a multiwell dish inside of the external LED + privacy film version of the LED box.
Supplementary Figure 25: Drilling holes on the box lid for the power switch and potentiometers. (A) A CAD drawing with annotated dimensions of the box lid. (B) The box lid with the potentiometer and power switch holes.
Supplementary Figure 26: Preparing the wire outlet hole. (A) A CAD drawing with annotated dimensions. (B) Image of the drilled hole with the drill bit. (C) Smoothing of outlet hole with high-speed rotary tool or filing tool. (D) Placing grommet in outlet hole.
Supplementary Figure 27: Placement of the microcontroller and the PCB in the box. (A) The microcontroller holder (orange) and PCB holders inside the box. (B) The microcontroller and PCB secured into the box.
Supplementary Figure 28: Placement of the potentiometers and the power switch. (A) A front view of a box lid with a power switch and four POTs. (B) A front view of the box lid with potentiometer knobs added. (C) A rear view of the box lid with the attached components.
Supplementary Figure 29: The assembled LED control system. (A) An open control box with the wires labeled with a label printer and zip tied for organization. (B) The box once it is fully assembled with each POT labeled along with the PIN.
Supplementary Figure 30: Placement of the crimped wire-to-wire connector. (A) Picture of the crimped wire-to-wire connectors for a four LED-microcontroller system. (B) Placement of the crimped connector into the microcontroller ports.
Supplementary Figure 31: Placing the jumper wires. (A) A circuit board with the coordinates of the red jumper wires labeled. (B) A circuit board with the coordinates of the yellow jumper wires labeled.
Supplementary Figure 32: Placing the jumper wires. A circuit board displaying coordinates of the yellow jumper wires.
Supplementary Figure 33: Adding the voltage regulators. The LM317T voltage regulators are added to the circuit with their coordinates labeled in the diagrams.
Supplementary Figure 34: Inserting the 820Ω resistors. The R1 resistors are added to the circuit with their coordinates labeled in the diagrams.
Supplementary Figure 35: Inserting the transistors. The 2N2222A transistors are added to the circuit with their coordinates labeled in the diagrams.
Supplementary Figure 36: Inserting the Female wire-to-wire connectors and Resistors (optional) for the POT connection. The wires and resistors are added to the circuit with their coordinates labeled in the diagrams. (A) Insert the red wire, followed by the R2 resistor (560Ω) (for the low voltage circuit only). (B) Insert the other end of the resistor into the indicated ground hole. (C) Insert the black wires into the marked holes to connect to ground. Note: R2 (560Ω) is parallel to the potentiometer.
Supplementary Figure 37: Inserting male wire-to-wire connectors for the microcontroller connection and power supply. The wires are added to the circuit with their coordinates labeled in the diagrams. (A) Insert the red wires into the indicated holes. (B) Insert the black wires into the marked holes.
Supplementary Figure 38: Adding LED wire-to-wire connectors. (A) Female wire-to-wire connectors with the red lead coordinates highlighted. (B) Female wire-to-wire connector with the black lead coordinates highlighted.
Supplementary Figure 39: Setting up a PhyB-PIF3 gene switch experiment. (A) An example table of a master mix containing Renilla for the internal control. (B) An example table for setting up the DNA mixture for a Dual-Luciferase Reporter Assay of a PhyB-PIF3 optogenetic experiment. (C) An example table for setting up PEI transfection reagent and aliquoting the mixture onto cells (dropwise). (D) Placement of the light meter for setting the LED brightness.