Magnetron sputtering has emerged as one of the most widely used thin-film deposition techniques in the development of thin-film transistors (TFTs) due to its excellent uniformity, scalability, and compatibility with large-area substrates. As display technologies and flexible electronics evolve, the demand for low-temperature, high-performance, and stable TFTs has made optimizing magnetron sputtering processes a critical research focus.

This Methods Collection aims to provide a comprehensive platform for sharing innovative protocols, process insights, and optimization strategies related to magnetron sputtering for TFT fabrication. Contributions may include novel sputtering configurations (such as HiPIMS, pulsed-DC, and co-sputtering), target and plasma engineering, process diagnostics, and post-deposition treatments, with emphasis on reproducibility and practical application in oxide, amorphous silicon, and emerging semiconductor materials.

By consolidating well-documented methods from academic and industrial perspectives, this collection will serve as a valuable reference for researchers seeking to improve TFT performance, reliability, and manufacturability. Ultimately, it aims to accelerate the development of next-generation display and sensing technologies by advancing the understanding and application of magnetron sputtering techniques.