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Laser-indotta Transfer Forward per Flip-chip Packaging di Dies Singolo
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Laser-indotta Transfer Forward per Flip-chip Packaging di Dies Singolo

Article DOI: 10.3791/52623-v • 08:21 min • March 20th, 2015
March 20th, 2015 •
1, 1
1Center for Microsystems Technology (CMST), Ghent University-imec

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Dimostriamo l'uso della Forward Transfer (LIFT) tecnica laser-indotta per l'assemblaggio flip-chip componenti optoelettronici. Questo approccio fornisce un conveniente, a bassa temperatura semplice, soluzione veloce e flessibile per la messa a passo urti e incollaggio sul chip-scala per raggiungere i circuiti ad alta densità per applicazioni optoelettroniche.

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Fisica LIFT,-scrittura diretta flip-chip interconnessioni indio micro-urti termo-compressione VCSEL
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