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Laser-indusert Forward Transfer for Flip-chip Pakking av Enkelt Dies
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Laser-indusert Forward Transfer for Flip-chip Pakking av Enkelt Dies

Article DOI: 10.3791/52623-v • 08:21 min • March 20th, 2015
March 20th, 2015 •
1, 1
1Center for Microsystems Technology (CMST), Ghent University-imec

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Vi demonstrere bruk av laser-indusert Forward Transfer (LIFT) teknikk for flip-chip montering av optiske komponenter. Denne tilnærmingen gir en enkel og kostnadseffektiv, lav temperatur, rask og fleksibel løsning for finraster bumping og bonding på chip-skala for å oppnå høy tetthet kretser for optoelektroniske applikasjoner.

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Fysikk LIFT direkte-skrive flip-chip sammenkoblinger indium mikro humper termo-komprimering VCSEL
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