Name: Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management (Video) | JoVE Journal
Uploaded: 2015-09-02T14:00:00.000+00:00
Duration: 8 min 50 s
Description: Learn to fabricate a skin-like electronic device for quantitative cutaneous wound management using elastomeric membranes and silicone coatings. This method enables real-time monitoring of temperature and thermal conductivity.

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5 minutes

This work was supported by the startup funding from the School of Engineering, Virginia Commonwealth University and some of electronic devices were prepared at the microfabrication facilities in the Wright Virginia Microelectronics Center. We acknowledge researchers who made contributions for the device and clinical data (Figures 3 and 5 in this paper), acquired from the published article10. W.-H.Y thanks Yoshiaki Hattori for the custom-made, data recording software.

The experiments for device fabrication, skin lamination, and characterization shown in Figures 1, 2, and 4 involved two volunteers, all performed in the Bio-interfaced NanoEngineering Laboratory at Virginia Commonwealth University (VCU), Richmond, VA, USA. This study was approved by the VCU Institutional Review Board (protocol number: HM20001454) and followed the research guidelines from the VCU Human Research. The device and clinical data shown in Figures 3 and 5 were acquired from the published article10 where the experiments on patients were conducted under the protocol (number: STU69718) approved by the Institutional Review Board, Northwestern University, Chicago, IL, USA.
1. Device Fabrication &#160;
NOTE: Figure 2 presents schematic illustrations for the overall fabrication process.
<ol>
	<li>Prepare a carrier substrate
	<ol>
		<li>Cut a bare 3 in&#160;silicon (Si) wafer into the desired size of the electronics by using a diamond blade. 
		NOTE: About half Si wafer gives an ideal size for the wound device.</li>
		<li>Degrease Si wafer with acetone and isopropyl alcohol (IPA). Rinse the wafer with deionized (DI) water and then dry with nitrogen and dehydrate on a hotplate at 110 &#176;C for 3 min.</li>
		<li>Prepare 11 g of polydimethylsiloxane (PDMS) mixture with 10:1 volume ratio of base and curing agent and degas the mixture in a vacuum chamber for an hour. 
		NOTE: PDMS is used for a dry pattern retrieval and transfer printing after the microfabrication, which is preferable to the wet chemical (acetone)-based approach from the previous study7.</li>
		<li>Spin coat 5 g of mixed PDMS solution on the wafer at 3,000 rpm for 1 min&#160;and fully cure on a hotplate at 150 &#176;C for 30 min.</li>
	</ol>
	</li>
	<li>Deposit materials and pattern electronics
	<ol>
		<li>Treat the PDMS-coated wafer with ultraviolet (UV)/ozone by using a UV lamp (8.9 mW/cm2) for 3 min&#160;to make the surface hydrophilic. 
		NOTE: The hydrophilic surface offers uniform coating of additional layers on the PDMS.</li>
		<li>Spincoat polyimide (PI; 2 ml) on the PDMS coated wafer, by pipetting, at 4,000 rpm for 1 min&#160;to form a 1.2-&#181;m-thick layer, pre-bake on a hotplate at 150 &#176;C for 5 min, and post-bake at 250 &#176;C for 2 hr.</li>
		<li>Deposit chromium (Cr) to form a 20 nm-thick layer and then deposit copper (Cu) to form a 3 &#181;m-thick layer by using electron-beam (e-beam) evaporation (base pressure: ~1&#215;10-7 Torr, deposition pressure: ~1&#215;10-6 Torr, deposition rate: 1 &#8211; 5 &#197;/s). Monitor the film thickness by the deposition controller interface embedded in the evaporator. 
		NOTE: The thick layer of Cu provides enough levels of electrical conductivity on the microscale resistors of the device and thin Cr layer is used to promote adhesion between PI and Cu.</li>
		<li>Spincoat a photoresist (2 ml) with three steps at 900 rpm for 10 sec, 1,100 rpm for 60 sec, and 4,000 rpm for 20 sec&#160;and then cure it on a hotplate at 75 &#176;C for 30 min. 
		NOTE: The sequential steps described above were used to deposit a thick (&#62; 10 &#181;m) photoresist.</li>
		<li>Align Cu electronic patterns (sensors; fractal &#8216;Peano&#8217; design with 35 &#181;m in width and interconnects; serpentine open mesh design with 50 &#181;m in width) at the center of the Si wafer by using a UV aligner (power: 10 mW/sec) with exposure time 25 s. 
		NOTE: The fractal structures are used to provide superior mechanical stretchability, compared to merely meandering features14.</li>
		<li>Develop the photoresist in a diluted base developer (1:2 ratio of developer and DI water) for a minute, rinse with DI water, and dry with nitrogen. Inspect the patterns (Cu fractals and interconnects) using a microscope to confirm the feature size and find any defects from particulates. 
		NOTE: If there are any unwanted defects, then remove photoresist by rinsing with acetone/IPA/DI water. After drying with nitrogen, repeat the steps from 1.2.4 to 1.2.6.</li>
		<li>Etch the Cu layer on the Si wafer by immersing in a wet chemical etchant for ~6 min&#160;(10 ml; mixture of ammonium persulfate and water in ratio of 1:4; etch rate of 8 nm/sec&#160;in 40 &#176;C), rinse with DI water, and dry with nitrogen. Inspect the patterns using a microscope for any over-etched patterns. 
		NOTE: If the patterns are over-etched, it may cause unwanted sharp edges of the features, which could lead to mechanical fracture during device handling and washing process. The prior testing results showed that more than ~20% over-etching of the original patterns caused the aforementioned issues.</li>
		<li>Etch the Cr layer with reactive ion etching (RIE; pressure: 300 mTorr, power: 200 W, CF4 gas: 5 sccm, O2 gas: 10 sccm) for 5 min. Inspect the patterns. 
		NOTE: For etching of the Cr layer, the RIE process is preferable to wet chemical etching that causes unfavorable reaction with the Cu layer.</li>
		<li>Remove the remained photoresist on the metal layers by immersing the wafer in acetone (10 ml), IPA (10 ml), and DI water (20 ml), respectively. Then, dry it with nitrogen.</li>
		<li>Spincoat PI (2 ml) on the metal deposited wafer, by pipetting, at 4000 rpm for 1 min&#160;to form a 1.2-&#181;m-thick layer, pre-bake on a hotplate at 150 &#176;C for 5 min, and post-bake at 250 &#176;C for 2 hr.</li>
		<li>Spincoat a photoresist (2 ml) with three steps at 900 rpm for 10 sec, 1,100 rpm for 60 sec, and 4,000 rpm for 20 sec&#160;and then cure it on a hotplate at 75 &#176;C for 30 min.</li>
		<li>Align PI patterns to encapsulate the Cu electronics (sensors; fractal &#8216;Peano&#8217; design with 35 &#181;m in width and interconnects; serpentine open mesh design with 250 &#181;m in width) with the pre-defined Cu fractals and interconnects by using a UV aligner (power: 10 mW/sec) with exposure time 25 sec.</li>
		<li>Develop the photoresist with a diluted developer (1:2 ratio of developer and DI water) for a minute, rinse with DI water, and dry with nitrogen. Inspect the patterns using a microscope to confirm the feature size and find any defects from particulates. 
		NOTE: If there are any unwanted defects, then remove photoresist by rinsing with acetone/IPA/DI water. After drying with nitrogen, repeat the steps from 1.2.10 to 1.2.13.</li>
		<li>Etch the PI layer with RIE (pressure: 170 mTorr, power: 150 W, O2 gas: 20 sccm) for 25 min. Inspect the patterns.</li>
		<li>Remove the remained photoresist by immersing the wafer in acetone (10 ml), IPA (10 ml), and DI water (20 ml), respectively. Then, dry it with nitrogen.</li>
	</ol>
	</li>
	<li>Prepare an elastomeric membrane
	<ol>
		<li>Prepare a 10 g of encapsulating silicone mixture (1:1 volume ratio of base and curing agent) and add a black ink15 with one to one volume ratio, which is to facilitate control measurements of temperature variation on the skin using an infrared camera. 
		NOTE: The utilized silicone (clear encapsulating rubber) provides unique characteristics of low viscosity, optical clarity, and electrical isolation/protection to the device16.</li>
		<li>Spincoat 8 g of the mixture in a petri dish at 150 rpm for 1 min&#160;to form a 500 &#181;m thick elastomeric membrane and cure at RT for O/N. 
		NOTE: The material needs to be placed on a flat surface for uniform thickness.</li>
		<li>Cut the membrane into the desired size of 70 mm x 30 mm by using a sharp razor blade and gently detach it from the petri dish.</li>
	</ol>
	</li>
	<li>Retrieve and transfer electronics
	<ol>
		<li>Cut a water soluble tape (25 mm x 80 mm) and gently laminate onto the fabricated electronic patterns and place them on a hotplate at 130 &#176;C for 3 min. 
		NOTE: Temperature elevation expands the PDMS layer on the Si wafer to help dissociation of the electronic patterns from the surface.</li>
		<li>Detach the tape rapidly from the PDMS/Si wafer to retrieve the electronic patterns.</li>
		<li>Deposit a 20 nm thick Cr (for adhesion) followed by a 50 nm thick silicon dioxide (SiO2) on retrieved patterns by e-beam evaporation.</li>
		<li>Treat UV/ozone by using UV lamp (365 nm, 8.9 mW/cm2) on the targeted silicone membrane for 2 min&#160;to activate the surface.</li>
		<li>Transfer the patterns to the silicone membrane by placing the retrieved patterns on the tape to the desired location and evenly adding pressure from top side of the patterns down to the substrate. Apply water to dissolve the tape for 5 min. 
		NOTE: The described process of materials transfer is facilitated by covalent bonding (Si-O-Si) between the deposited silicon dioxide&#160;and the UV-activated silicone substrate17.</li>
		<li>Peel off the tape, rinse with DI water, and dry on a hotplate at 90 &#176;C for 1 min.</li>
	</ol>
	</li>
	<li>Encapsulate the device using a silicone membrane
	<ol>
		<li>Prepare an 10 g of encapsulating silicone mixture (1:1 volume ratio of base and curing agent).</li>
		<li>Cover the cable contact pads with a rectangular PDMS piece (22 &#215; 6 &#215; 1 mm3) by van der Waals bonding with the bottom silicone membrane, to avoid silicone coating the pads.</li>
		<li>Spincoat the 5 g of silicone mixture at 4,000 rpm for 1 min&#160;to form a 5 &#181;m thick layer on the transferred electronics and then cure at RT for O/N.</li>
	</ol>
	</li>
	<li>Connect a flexible ribbon cable for data acquisition
	<ol>
		<li>Apply liquid steel flux (0.5 ml), by pipetting, on the connector pads for 3 sec&#160;to make clean surface.</li>
		<li>Bond a thin, flexible ribbon cable on the contact points with pressure at high temperature (&#62; 60 &#176;C). A typical hair straightener offers easy handling and bonding. 
		NOTE: The micro-film cable is preferable to the conventional hard-wire soldering to avoid any mechanical fracture of the transferred metal membranes on a silicone.</li>
		<li>Check the electrical connection using a digital multimeter. The resistance value is expected less than 1 Ohm between the sensor pad with one end and the other end of the film cable (distance: ~1 cm apart).</li>
		<li>Bond the other end of the ribbon cable to a customized printed circuit board with the same strategy described in the step 1.6.2.</li>
		<li>Check the electrical connection using a digital multimeter.</li>
		<li>Connect the device with the data acquisition hardware by soldering conventional wires on PCB.</li>
	</ol>
	</li>
</ol>
2. Clinical Testing &#160;
<ol>
	<li>Clean the device using a disinfectant solution
	<ol>
		<li>Prepare 205 g of a diluted disinfectant solution (40:1 volume ratio of water and solution).</li>
		<li>Spray the solution (10 g) on the device and soak it for 10 min. 
		NOTE: The diluted disinfectant cleaner can be stored at RT.</li>
		<li>Rinse with water three times and dry it with clean tissues.</li>
	</ol>
	</li>
	<li>Set up a series of equipment for device testing
	<ol>
		<li>Prepare and connect a lock-in amplifier with a current source, a multiplexer, and the custom software installed on a laptop computer for data recording.</li>
		<li>Place an infrared camera on a tripod and focus on a target object for thermography as a reference.</li>
		<li>Set up system parameters of a lock-in amplifier to measure thermal conductivity (frequency: 1 &#38; 3 Hz; time constant: 3 and 1 sec; sensitivity: 1 mV; dynamic reserve: high reserve) and temperature (frequency: 997 Hz; time constant: 300 msec; sensitivity: 2 mV; dynamic reserve: low noise) with the applied constant current (2 mA).</li>
		<li>Connect two wound devices, prepared by microfabrication and transfer printing and mounted on wound and contralateral sites, to the multiplexer right before recording data from a patient.</li>
	</ol>
	</li>
	<li>Record temperature and thermal conductivity 
	NOTE: The data acquisition software is custom-made, which can remote control the lock-in amplifier for real-time data monitoring and saving. In the temperature measurement, each data point is measured every 300 msec for 20 sec. The set of data for the first 10 sec&#160;and next 10 sec&#160;are used to calculate the average temperature value and standard deviation, respectively. The recorded data are then saved as a comma-separated value file, which is used to plot a graph for comparison with data from infrared thermography. In the measurement of thermal conductivity, the 3&#937; signals are directly read from the hardware screen (amplifier), which is then utilized to calculate the thermal conductivity analytically.
	<ol>
		<li>Gently rub the device application sites on the skin using antiseptic alcohol wipes10.</li>
		<li>2.3.2) Laminate two devices on the desired skin locations by gently pressing the device to the skin with fingers to facilitate the soft bonding: one on the surgical wound site and the other on the contralateral location as a reference.</li>
		<li>Measure the electrical voltage (3&#937;), related to thermal conductivity, of the device by starting the data acquisition.</li>
		<li>Evaluate the obtained data to verify the conformal contact of the device to the skin; abnormal value (&#60; 0.1 W/mK) shows bad contact of the device.</li>
		<li>Measure the electrical resistance to determine temperature distribution and record data through the custom software.</li>
		<li>Take optical and IR images of two devices on the skin.</li>
		<li>Compare temperature values from the IR images with the data recorded from the wound device (2.3.5). Add both values to separate columns in a customized spreadsheet.</li>
	</ol>
	</li>
	<li>Analyze the recorded data
	<ol>
		<li>Export the recorded data to the customized template to automatically calculate temperature and thermal conductivity from an array of sensors in the device.</li>
		<li>Plot the data (temperature and thermal conductivity according to the sensor location on a different time scale) for comparison over the course of one month (four sets of data on day 1, 3, 15, and 30).</li>
		<li>Analyze the data by comparing a series of temperature and thermal conductivity data according to time; Values with sudden elevation or drop tell the change of wound healing phase and/or unexpected abnormality on wound sites.</li>
	</ol>
	</li>
</ol>

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</ol>

The authors declare that they have no competing financial interests.

This article highlights the methods and protocols to fabricate a conformal, skin-like electronics system that enables conformal lamination near the wound tissues, which offers quantitative measurement of skin temperature and thermal conductivity mapping on the skin. 
The key features include the utilization of novel techniques of materials transfer printing and hard-soft materials integration to design and develop the flexible/stretchable, soft electronic device. The use of biocompatible, elec...

In clinical study and biomedical research, monitoring of wound healing has focused on an invasive method that is based on the histological evaluation of tissue morphologic change in wounds1,2. Recently, rapid advancements in electronic technologies enable the development of high-precision imaging and analysis tools that can visually inspect the wound healing process via digital imaging3,4 or confocal scanning microscopy and spectroscopy4,5. However, those imaging approaches require high cost, complicated optical tools and operations, and more importantly, patients need to be immobilized during testing. Therefore, there exists a need for new devices and systems that are quantitative, non-invasive, easy-to-use, inexpensive, and multifunctional to offer more accurate wound management.
Here, we introduce a skin-like electronic system that provides precise, real-time mapping of temperature and thermal conductivity and delivers a precise level of heating at wound sites via conformal lamination of the device non-invasively. This device presents a class of technology, skin-mounted epidermal electronic systems that are designed to match to mechanical and material properties (total thickness, bending stiffness, effective moduli, and mass density) of the epidermis6-9.
The device is designed in a biocompatible, skin-friendly, water-proof, and reusable form that can be washed and disinfected for clinical applications on patients10. The conformal electronic device mounted near the wound tissues captures the inflammation phase (one of wound healing process), caused by increased blood flow and enzymatic reactions to the wound11,12, through quantitative recording of temperature8 and thermal conductivity13, correlated to hydration. Experimental and computational studies determine an optimal mechanics design to accommodate natural motions and applied strains without mechanical fracture and capture the underlying physics of stretching mechanics of the skin-like electronics that laminates conformally on the skin surface, which offers acquisition of high fidelity signals.
The protocols described in this article present the methods of microfabrication for skin-like electronic systems, testing preparation including device cleaning, equipment setup in a clinical setting, and clinical applications for quantitative monitoring of temperature and thermal conductivity on cutaneous wounds.

<table><tbody><tr><td>3&quot; Silicon wafer</td><td>University Wafer, USA</td><td></td><td>Use as carrier to fabricate the device</td></tr><tr><td>Acetone</td><td>Fisher Scientific, USA</td><td>A18-1</td><td>Use to clean a wafer and to remove photoresist</td></tr><tr><td>Isopropanol (IPA)</td><td>Fisher Scientific, USA</td><td>A459-1</td><td>Use to clean a wafer</td></tr><tr><td>AZ4620 photoresist</td><td>AZ Electrionic Materials, USA</td><td></td><td>Use to make patterns on metals and polymers</td></tr><tr><td>AZ400K developer</td><td>AZ Electrionic Materials, USA</td><td></td><td>Use to develop AZ4620 photoresist</td></tr><tr><td>Chromium etchant</td><td>Transene, USA</td><td>1020AC</td><td>Use to etch Cr layer of device</td></tr><tr><td>Copper etchant</td><td>Transene, USA</td><td>ASP-100</td><td>Use to etch Cu layer of device</td></tr><tr><td>Sylgard 184 Silicone Elastomer Kit (PDMS)</td><td>Dow Corning, USA</td><td>39100000</td><td>Use as a substrate for &#039;dry&#039; retrieval</td></tr><tr><td>PI2545 polyimide</td><td>HD MicroSystem, USA</td><td></td><td>Use to encapsulate metal layer</td></tr><tr><td>Solaris</td><td>Smooth-On, USA</td><td></td><td>Use as substrate and to encapsulate device</td></tr><tr><td>Petridish</td><td>Carolina, USA</td><td>741255</td><td>Use as mold to make substrate</td></tr><tr><td>Water-Soluble Wave Solder Tape 5414</td><td>3M, USA</td><td>AM000000217</td><td>Use to retrive device from PDMS layer</td></tr><tr><td>High Activity Liquid Stainless Steel Flux</td><td>Worthington, USA</td><td>331929</td><td>Use to remove oxidation layer on Cu</td></tr><tr><td>Flexible, micro-film cable</td><td>Elform, USA</td><td></td><td>Use to make the electrical connection between the electronic device and the data acquisition system</td></tr><tr><td>pH Neutral Cleaner</td><td>Australian Gold, USA</td><td></td><td>Use as disinfectant solution to clean device in clinical testing</td></tr><tr><td>Solder</td><td>Kester, USA</td><td>24-6337-9703</td><td>Use as material to solder hard wires</td></tr><tr><td>Ultraviolet lamp</td><td>Cole-Parmer, USA</td><td>97600-00</td><td>Use to activate PDMS layer as hydrophilic surface</td></tr><tr><td>Multiplexer</td><td>FixYourBoard, USA</td><td>U802</td><td>Use to acquire measurements from six sensing components&amp;nbsp;</td></tr><tr><td>DC/AC current source</td><td>Keithley, USA</td><td>6221</td><td>Use to supply current</td></tr><tr><td>SMD Digital Hot Air Rework Station</td><td>Aoyue, China</td><td>968A+</td><td>Use to solder hard wires, to electrically connect between the device and external instruments</td></tr><tr><td>Infrared camera</td><td>FLIR, USA</td><td>435-0001-01-00</td><td>Use to take infrared images in experiment</td></tr><tr><td>Digital multimeter</td><td>Fluke, USA</td><td>117</td><td>Use to check electrical connection</td></tr><tr><td>Lock-in amplifier</td><td>Stanford Research System, USA</td><td>SR830</td><td>Use to perform four-point-probe-measurement</td></tr><tr><td>Electron beam evaporator</td><td>9 scale Vacuum Products, USA</td><td></td><td>Use to deposit thin films (Cu and SiO&lt;sub&gt;2&lt;/sub&gt;)</td></tr></tbody></table>

fabrication and characterization of a conformal skin-like electronic system for quantitative, cutaneous wound management

Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management

Recent advances in the development of electronic technologies and biomedical devices offer opportunities for non-invasive, quantitative assessment of cutaneous wound healing on the skin. Existing methods, however, still rely on visual inspections through various microscopic tools and devices that normally include high-cost, sophisticated systems and require well trained personnel for operation and data analysis. Here, we describe methods and protocols to fabricate a conformal, skin-like electronics system that enables conformal lamination to the skin surface near the wound tissues, which provides recording of high fidelity electrical signals such as skin temperature and thermal conductivity. The methods of device fabrication provide details of step-by-step preparation of the microelectronic system that is completely enclosed with elastomeric silicone materials to offer electrical isolation. The experimental study presents multifunctional, biocompatible, waterproof, reusable, and flexible/stretchable characteristics of the device for clinical applications. Protocols of clinical testing provide an overview and sequential process of cleaning, testing setup, system operation, and data acquisition with the skin-like electronics, gently mounted on hypersensitive, cutaneous wound and contralateral tissues on patients.

Figure 1 presents an overview of the characteristics of the conformal, skin-like electronic system, designed for quantitative, cutaneous wound management on patients. The multifunctional electronic device consists of microscale fractal structures3,14 and filamentary serpentine traces9,17 on a thin elastomeric membrane that offers exceptional mechanical stretchability and bendability. The compliant device that is completely enclosed by silicone layers enables gentle, reversible lamin...

This article presents methods to fabricate and characterize a conformal, skin-like electronic system and protocols for the use in clinical applications, particularly on cutaneous wound management.

Recent advances in the development of electronic technologies and biomedical devices offer opportunities for non-invasive, quantitative assessment of ...

The overall goal of this procedure is to fabricate a skin like electronic device for quantitative cutaneous wound management. This is accomplished by first developing an electronic device on a carrier substrate. The second step is to prepare an elastomeric membrane to embed the electronics.Next, the fabricated electronics are retrieved from their fabrication compound and transferred onto the membrane. The final steps are to enclose the electronics with a silicone coating and connect a flexible cable for data acquisition. The completed device is laminated near the wound tissue of a patient to monitor time, varying temperature and tissue thermal conductivity as wound management.The main advantage of this device over existing tools based on microscopic visual inspections is that it can provide multifunctional quantitative monitoring of temperature and thermal conductivity near the wound tissue. The soft biocompatible and skin wearable device provides the functions and characteristics for the use in the clinical settings, and it has a great potential to address important issues in chronic wound management. This spin coating protocol can be performed on silicon wafers of any size.To begin degrease the wafers with acetone and isopropyl alcohol. Then rinse them in deionized water and dry them under nitrogen. Dehydrate the wafer for three minutes on a hot plate set to 110 degrees Celsius.Now spin coat five grams of PDMS onto the wafers at 3000 RPM For a minute, complete the process by curing the wafers on a hot plate set to 150 degrees Celsius for half an hour. After UV treating the PDMS coated wafers for three minutes, spin coat polyamide onto the wafers. Apply two milliliters with a pipette and spin at 4, 000 RPM for a minute for a 1.2 micron layer.Then pre-bake the wafers on a hot plate at 150 degrees Celsius for five minutes and bake them in an oven at 250 degrees Celsius for two hours. Next, using an electron beam evaporation deposit, a 20 nanometer thick layer of chromium for adhesion, followed by a three micron thick layer of copper for conductivity. Next, spinco two milliliters of photoresist onto the wafers in three steps for a sub 10 micron layer.Now cure the wafers on a 75 degree Celsius hot plate for 30 minutes. Next, use a UV aligner at 10 milliwatts per second to center the copper electronic pattern to the wafer. Use an exposure time of 25 seconds.A fractal pattern is used to make sensors and an open mesh is made for the interconnects. Develop the photo resist in 33%developer solution for one minute. Then rinse the chips with deionized water and dry them under a nitrogen stream.Before proceeding, check the patterns under a microscope for defects. Next, etch the copper on the wafer using a six minute bath in chemical etching. Following the etching, rinse and dry the wafers.As before, check the etched patterns under a microscope greater than 20%over etching of the copper leads to mechanical failures. To etch the chromium layer, use five minutes of reactive ion etching. After checking the etching, remove the remaining photo resists with 10 milliliters of acetone, followed by 10 milliliters of isopropanol.And thirdly, 20 milliliters of deionized water. Follow the baths by drying the wafers under a nitrogen stream. For this protocol, make 10 grams of an encapsulating silicone mixture for the target material onto which the electronics will be transferred onto a 10 centimeter wide Petri dish.Spin coat, eight grams of mix at 150 RPM for a minute. For a half millimeter silicone coating. Let this cure overnight at room temperature.Next, attach sized pieces of water soluble tape onto the pattern chips to act as a laminate surface for the electronic patterns. After attaching the tape, heat the wafers for three minutes at 130 degrees Celsius. Then rapidly peel the tape off to detach and retrieve the electronics onto the retrieve patterns.Use e-beam evaporation to deposit 20 nanometers of chromium for extra adhesion. Then deposit 50 nanometers of silicon dioxide onto the chromium layer. Now retrieve the silicone layer and treat it with 365 nanometer UV light for two minutes at 8.9 milliwatts per square centimeter.This activates the surface with the silicone activated. Press the retrieved electronics into the silicone, spread them out evenly on the target material. Then treat the tape with water to dissolve it, and after five minutes, peel away the tape.Then rinse the silicone with deionized water and dry on a 90 degree Celsius hot plate for a minute. To create the device, start by covering the contact pads with a rectangular piece of PDMS using Vander Wall's bonding force. Now onto the transfer electronics spinco five grams of encapsulated silicone mixture at 4, 000 RPM for a minute.This makes a five micron thick layer, which is cured overnight at room temperature. The next day, clean the sensor pads with half a milliliter of liquid steel flux for three seconds. Then bond a flexible ribbon cable to the contact points with pressure and heat in excess of 60 degrees Celsius.Check the connections with a multimeter. The resistance between the sensor pad and the film cable one centimeter apart should be less than an ohm bond the other end of the ribbon cable to a customized circuit board in the same way. Finally, connect the device to data acquisition hardware by soldering conventional wires to the PCB.Using the described protocol, the electronic sensor device was fabricated. The flexibility of the device was examined. Mechanical fracture under tensile strain did not occur and the device was functional.The resistance at six sensor locations was measured using a high precision hot plate. There was a linear relationship showing that the sensors were well calibrated to detecting subtle changes in temperature. Furthermore, an adapted three omega signal was used to evaluate the thermal conductivity with the device in a clinical setting.The device was used to monitor wound healing post-surgery for up to a month. The temperature of the wound healing process was thus measured. There was intense inflammation at the wound site at day three, which is reflected by the temperature spike measured by the device.After watching this video, you should have a good understanding of how to fabricate a conformal schemic electric device for quantitative wound management on patients.

fabrication-characterization-conformal-skin-like-electronic-system

Research

JoVE Journal

Bioengineering

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Learn to fabricate a skin-like electronic device for quantitative cutaneous wound management using elastomeric membranes and silicone coatings. This method enables real-time monitoring of temperature and thermal conductivity.

Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management

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