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Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
 

Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers

Article DOI: 10.3791/61040-v
February 8th, 2022

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Summary February 8th, 2022

A protocol for metal-assisted chemical imprinting of 3D microscale features with sub-20 nm shape accuracy into solid and porous silicon wafers is presented.

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