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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
 

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

Article doi: 10.3791/61468
July 3rd, 2020

Summary July 3rd, 2020

An experimental methodology based on thermal and rheological measurements is proposed to characterize the curing process of adhesives with to obtain useful information for industrial adhesive selection.

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