/
/
Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
A subscription to JoVE is required to view this content. Sign in or start your free trial.
1Department of Mechanical Engineering,University of Hong Kong, 2Department of Mechanical Engineering,University of Michigan, 3Department of Electrical Engineering and Computer Science,University of Michigan, 4Department of Chemistry,University of Hong Kong, 5HKU-Shenzhen Institute of Research and Innovation
Chapters
- 00:05Title
- 01:27Photolithography-based Fabrication of an Embedded Metal-mesh Transparent Electrode (EMTE)
- 05:14Electron-beam Lithography-based Fabrication of a Sub-micron EMTE
- 07:44EMTE Characterization
- 08:33Results: EMTE Fabrication by the Lithography, Electroplating, and Imprint Transfer (LEIT) Method
- 10:05Conclusion
This protocol describes a solution-based fabrication strategy for high-performance, flexible, transparent electrodes with fully-embedded, thick metal mesh. Flexible transparent electrodes fabricated by this process demonstrate among the highest reported performances, including ultra-low sheet resistance, high optical transmittance, mechanical stability under bending, strong substrate adhesion, surface smoothness, and environmental stability.
Tags
Keywords: Solution-processedFlexibleTransparent ElectrodesEmbedded Metal MeshLithographyElectrodepositionImprint TransferHigh PerformanceScalable FabricationSelf-anchoredMechanical StabilityHigh-throughputLow-cost ProductionElectron Beam LithographyFTO GlassPhotoresistUV ExposureCopper Electroplating
