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DOI: 10.3791/66643-v
Xiang Wang1, Qianxi Sun1, Chengji Lu2, Minkai Zhang2, Jiangcheng Jin2, Linsen Mu3, Enlin Li3, Anxin Wang3, Mingge Wu1,2,3,4
1College of Mechanical and Electrical Engineering,Wenzhou University, 2Institute of Laser and Optoelectronic Intelligent Manufacturing,Wenzhou University, 3Wecome Intelligent Manufacturing Co., Ltd., 4College of Mechanical Engineering,Nanjing University of Aeronautics and Astronautics
This study focuses on the simulation and analysis of temperature rise in electrical equipment. By employing a comparative analysis of different temperature field-solving modules, the research aims to enhance the accuracy of temperature predictions.
This paper addresses the temperature rise problem of the ring main unit by establishing a simplified model and conducting a comparative analysis in two temperature field-solving modules.
Our research deals with the simulation and analysis of temperature rising of equipment. By comparing to temperature analysis, the module, we derived the temperature rising of for different Aspect was more suited for transfer, and the studies that was better suit for herd distribution. The current method of combining the finite element method will actually experiments derives the temperature rise more comprehensively.
The biggest challenger is to make the simulation results compatible with the experiment and to reduce the error. Currently, the simulation error is mainly reduced by solving the problem multiple times. Our protocol reduce the error or a single solution model that cannot satisfy the temperature rising program or It can provide a multifaceted solution to a problem of temperature rising or electrical equipment, combined with the variety of finite element method for interpretation.
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