Sputtering Yield
Sputtering Yield - Related Videos
12:20
Sputter Growth and Characterization of Metamagnetic B2-ordered FeRh Epilayers
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Cited by 23 •
2013
A method to prepare epitaxial layers of ordered alloys by sputtering is described. The B2-ordered FeRh compound is used as an example, as it displays a metamagnetic transition that depends sensitively on the degree of chemical order and the exact composition of the alloy.
01:31
ATP Yield
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2019
Cellular respiration produces 30 - 32 ATP per glucose molecule. Although most of the ATP results from oxidative phosphorylation and the electron transport chain (ETC), 4 ATP are gained beforehand (2 from glycolysis and 2 from the citric acid cycle). The ETC is embedded in the inner mitochondrial membrane and is comprised of four main protein complexes and an ATP synthase. NADH and FADH2 pass electrons to these complexes, which pump protons into the intermembrane space. This distribution of...
10:07
Improving Thermoelectric Properties of Bi2Te3 Thin Films By Manganese Co-Sputtering
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2026
A radiofrequency co-sputtering protocol was developed to fabricate manganese-doped Bi2Te3 thin films and evaluate how manganese input influences structural and thermoelectric transport properties. Moderate manganese incorporation improved film uniformity and power-factor-related transport behavior, while higher manganese input increased structural disorder and resistivity.
02:22
Reaction Yield
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2020
The theoretical yield of a reaction is the amount of product estimated to form based on the stoichiometry of the balanced chemical equation. The theoretical yield assumes the complete conversion of the limiting reactant into the desired product. The amount of product that is obtained by performing the reaction is called the actual yield, and it may be less than or (very rarely) equal to the theoretical yield. Percent Yield In the case of chemical reactions, the actual yield of the product is...
01:24
Bond Yields and the Yield Curve: Putting It All Together
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2026
Bond yields and the yield curve are fundamental components of fixed-income markets, influencing investment decisions, economic policies, and financial conditions. Bond yields reflect the annual return an investor can expect from holding a bond until maturity. Prevailing interest rates, bond prices, and credit risk influence these yields. Since bond prices and yields move inversely, a rise in bond prices results in lower yields, while a decline in bond prices leads to higher yields.The yield...
FAQs
Increasing ion energy generally strengthens momentum transfer and can produce a larger collision cascade beneath the surface. However, ejection occurs only when deposited energy is sufficient to overcome the material’s surface-binding energy. This relationship helps engineers identify operating conditions that promote controlled material removal rather than assuming that every incoming ion produces the same erosion response.
Ion mass influences how efficiently an incoming ion transfers momentum during collisions, while target composition affects both collision behavior and the energy needed for atoms or molecules to leave the surface. Consequently, changing the ion or the target can alter the number of particles ejected per impact. These dependencies are important when comparing materials or selecting processing conditions.
The angle at which ions strike a surface changes the location and geometry of the resulting collision cascade. Because sputtering yield depends on incidence angle, the same ion energy can produce different erosion rates on differently oriented surfaces. Accounting for this variable improves predictions of surface wear and material transport, especially in engineered components exposed to directional ion bombardment.
Surface-binding energy sets the energetic barrier that ejected atoms or molecules must overcome to escape the target. Ion bombardment can create a collision cascade, but only sufficient deposited energy leads to emission from the surface. Including this threshold in models helps distinguish conditions that generate measurable sputtering from those that mainly redistribute energy within the material.
Engineers combine sputtering yield with the expected ion-bombardment conditions to estimate how rapidly a surface may lose material. Because the yield reflects ion energy, mass, incidence angle, and target composition, changing any of these variables can change the predicted erosion response. Such estimates support component evaluation and the design of systems where ion-induced wear must be controlled.
In thin-film deposition, sputtering yield helps engineers anticipate how much target material can be transported for given bombardment conditions. In ion-beam etching, it supports estimates of material removal from a selected surface. Using the same measure for these related processes allows conditions to be adjusted for controlled deposition, patterning, or surface modification.
Sputtering yield supplies a quantitative link between ion bombardment and the amount of target material released into a processing environment. Plasma-processing models can use that relationship to assess material transport and predict how operating conditions influence outcomes. This makes the parameter relevant to engineering control of fabrication processes, including those used in semiconductor manufacturing.
Energetic ion bombardment can remove material while also generating subsurface collision cascades. Sputtering yield therefore helps describe one aspect of how radiation exposure changes an engineered surface and transports material away from it. Incorporating the parameter into radiation-related analysis supports modeling of erosion and surface evolution in materials subjected to energetic-particle environments.