Gold Silver Sputtering
Gold Silver Sputtering - Related Videos
12:39
Gold Nanostar Synthesis with a Silver Seed Mediated Growth Method
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Cited by 28 •
2012
We synthesized star shaped gold nanostars using a silver seed mediated growth method. The diameter of the nanostars ranges from 200 to 300 nm and the number of tips vary from 7 to 10. The nanoparticles have a broad surface plasmon resonance mode centered in the near infrared.
13:02
Microfabrication of Nanoporous Gold Patterns for Cell-material Interaction Studies
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Cited by 16 •
2013
We report on techniques to micropattern nanoporous gold thin films via stencil printing and photolithography, as well as methods to culture cells on the microfabricated patterns. In addition, we describe image analysis methods to characterize morphology of the material and the cultured cells using scanning electron and fluorescence microscopy techniques.
09:00
Evaluating Plasmonic Transport in Current-carrying Silver Nanowires
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Cited by 1 •
2013
Silver nanowires can simultaneously transport electrons and optical information in the form of surface plasmons. A procedure is described here to realize such a shared circuitry and the limitations at propagating both information carriers are evaluated.
08:55
Hydroquinone Based Synthesis of Gold Nanorods
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Cited by 11 •
2016
This paper describes a protocol for the synthesis of gold nanorods, based on the use of hydroquinone as reducing agent, plus the different mechanisms for controlling their size and aspect ratio.
10:07
Improving Thermoelectric Properties of Bi2Te3 Thin Films By Manganese Co-Sputtering
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2026
A radiofrequency co-sputtering protocol was developed to fabricate manganese-doped Bi2Te3 thin films and evaluate how manganese input influences structural and thermoelectric transport properties. Moderate manganese incorporation improved film uniformity and power-factor-related transport behavior, while higher manganese input increased structural disorder and resistivity.
FAQs
The plasma supplies energetic ions that strike the metal target and transfer enough energy to eject gold, silver, or both as atoms. These atoms enter the vapor phase and move toward the substrate, where they condense into a film. The plasma therefore connects the applied process conditions with material removal from the target and coating formation.
Power and pressure are key process variables because they affect how target material is removed and transported through the chamber. Together with substrate conditions, they influence the deposited film’s thickness and structure. Controlling these factors allows engineers to adjust surface coatings for different requirements rather than producing an identical layer under every operating condition.
Material selection depends on the surface property the engineered system needs. Gold and silver can provide conductive coatings for electronics, while their use in reflective layers supports optical devices. Either metal, or a combination, may also be selected for protective, decorative, or functional surfaces, including coatings incorporated into sensors and other engineered systems.
A typical sequence places the metal target and solid substrate inside a vacuum chamber, establishes conditions for plasma generation, and uses energetic ions to bombard the target. Ejected atoms then travel through the vapor phase and condense on the substrate. Adjusting power, pressure, and substrate conditions during this sequence helps control the resulting film thickness and structure.
The essential materials are a gold target, a silver target, or a target arrangement containing both, together with the solid surface to be coated. The process also requires a vacuum chamber and a plasma that generates energetic ions. Power, pressure, and substrate conditions are central operating factors because they influence how the deposited layer develops.
These coatings serve several engineering functions. Their conductivity supports electronic components, while reflective layers serve optical devices. Protective and decorative surfaces represent additional uses, and functional coatings can contribute to sensors and other engineered systems. The technique is valuable when a surface needs controlled modification without changing the role of the underlying solid substrate.