The microdrive array was constructed within 5 days. The timeline of microdrive preparation is described in Table 2. Using this microdrive, nine tetrodes and one silicon probe were implanted into the hippocampal CA1 and MEC of the mouse [21 week old/29 g body weight male pOxr1-Cre (C57BL/6 background)], respectively. This transgenic mouse expresses Cre in MEC layer III pyramidal neurons. The mouse was injected with 200 nL of AAV5-DIO-ChR2-YFP (titer: 7.7 x 1012 gc/mL) into the MEC 10 weeks before the electrode implant. LFPs were recorded using a low-pass filter (1-500 Hz), and spiking units were detected using a high-pass filter (0.8-5 kHz). Light stimulation (λ = 450 nm) was performed using a 1 ms pulse width at 10.6 mW intensity measured at the end of the fiber connector. The reference electrode for the tetrode recording was placed in the white matter using a dedicated tetrode wire. The reference for the silicon probe recording was set as the top channel of the probe.
After the tetrode adjustment, behavioral performance was tested on a linear track (Figure 5A) and in an open field (Figure 5B). In both experiments, the mouse explored freely for ~30 min (Figure 5Aa,b,c; Figure 5Ba,b,c). The electrophysiological signals were successfully recorded without severe motion-related noise throughout the recording session (Figure 5Ad,e; Figure 5Bd,e). Next, light stimulation was performed at the MEC to stimulate MEC layer III neurons that project to the CA143 (Figure 6A). Spontaneous spiking activities (Figure 6B,C) and LFPs (Figure 6D) were recorded from the tetrodes and silicon probe when the mouse was sleeping. LFPs recorded in the tetrodes showed large ripple activities, suggesting that all tetrodes were positioned in the vicinity of the CA1 pyramidal cell layer. Light-induced responsive activities were first observed in MEC, followed by in CA1 with 13-18 ms latency (Figure 6E).

Figure 1: Microdrive array overview. (A) A skeleton view of the microdrive array, from the tetrode side (a) and silicon-probe side (b). (B) A real image of the loaded microdrive array, viewed from the tetrode side (a) and from the silicon-probe side (b). The microdrive array is placed on the jig stage in panel (b). (C) Individual 3D-printed microdrive array parts. (a-d) The microdrive array body, viewed from four different angles (a: tetrode side view; b: silicon-probe side view; c: top view; d: bottom view). A magnified view of the dashed line in panel (c) is shown in Figure 2A. (e) The shuttle, which holds and allows adjusting of the silicon-probe. A silicon probe is attached at the dashed line in panel (e). (f) The probe-connecter holder, which holds a 32-channel silicon-probe connecter. (g) The fiber ferrule holder, which holds an optical fiber ferrule to prevent from the movement of the probe when plugging/unplugging the fiber connector with the light-source. This part consists of two components: [panel (g) and components A and B]. (h) The printed shielding cone, which provides physical and electrical shielding when painted with conductive material. The cone window allows the ability to see inside of the structure during microdrive array preparation, which is eventually covered by a piece of tape or 3D-printed material. Please click here to view a larger version of this figure.

Figure 2: Preparation of guide-posts and microdrive screws on the main body. (A) Guide post-preparation. (a) Magnified view of the microdrive array body shown in Figure 1Cc. (b) Guide post-insertion into the holes of the body. (B) The microdrive-screw designs. (a) The microdrive-screw for a silicon-probe, which consists of a 300 µm pitch custom screw, supporting tube, and L-shape tube. (b) The microdrive-screw for a tetrode, which consists of a 160 µm pitch custom screw and 30 G stainless guide tube. (C) Fabrication of the top piece of the microdrive-screws: (a) Preparation of 3D-printed patterns of the anti-mold for the microdrive-screw. The picture shows a pattern for the silicon-probe microdrive-screw. (b) The mold made using the anti-mold pattern (a) and silicon-rubber material. Assembled microdrive-screws are produced by inserting custom-screws and wires/tube, and pouring dental acrylic in each well. Inset: magnified view of the wells of the mold. Please click here to view a larger version of this figure.

Figure 3: Microdrive array assembly. (A) Preparation of an opto-silicon probe. (a) Attaching two plastic guide tubes to the shuttle. (b) Gluing the optical fiber to the silicon-probe. (c) Attaching the shuttle to the opto-silicon probe. In this picture, the bottom part of the shuttle (dashed line) is attached to the silicon-probe’s base [backside of (b)]. The shuttle and the silicon probe shank should be in parallel. (B) Loading the opto-silicon probe shuttle assembly into the guide-posts of the microdrive array body. (C) Relative position of the silicon-probe microdrive when the probe is completely retracted into the body (a) and when positioned at the lowest in the drive body (b). The L-shape wire is inserted into the groove on the shuttle. (D) An exploded view of the fiber ferrule holder and the probe connector mount. (E) Shielding cone attached. The conductive material is painted inside of the cone. (F) Alternative shielding cone using a paper and aluminum tape. (a) A pattern paper. (b) An attached alternative shielding cone, which reduces 1.1 g of weight compared to the 3D-printed version. Please click here to view a larger version of this figure.

Figure 4: Sealing the probes during surgery and recovery of the silicon probe. (A) The microdrive array and the mouse skull after craniotomy, before applying silicon-grease. The silicon-probe is inserted about 2mm into the brain at this time. (B) Applying silicon-grease around the silicon-probe and tetrode bundles to protect the probes from dental acrylic. (C) The chronically implanted mouse after the recovery period, when the mouse is walking (a), grooming (b), and when connected to the recording cable with the counter-balancing pulley system (c). (D) The recovered silicon probe, before (a) and after (b) immersion into the cleaning solution. The biological tissues in (a) are removed after the cleaning process (b). Please click here to view a larger version of this figure.

Figure 5: Examples of simultaneous tetrode/silicon-probe recording in the hippocampal CA1 and medial entorhinal cortex (MEC) from the behaving mouse. (A) Recording on the linear track. (a) The linear track used for the recoding. (b) Trajectories of the mouse exploration for ~30 min on the track. (c) Behavioral performance on the linear track. (d-e) Representative LFP recordings from the tetrode (d) and the silicon-probe (e). (B) Recording in the open field. (a) The open field chamber used for the recoding. (b) Trajectories of the mouse exploration for ~30 min in the chamber. (c) Behavioral performance in the open field. (d,e) Representative LFP recordings from the tetrode (d) and the silicon-probe (e). LED is attached to the head amplifier to record the positions of the mouse. The linear track and the open-field chamber are connected with the electrical ground to reduce electrostatic noise. Please click here to view a larger version of this figure.

Figure 6: Representative results of simultaneous recordings in the CA1 and MEC and optogenetic stimulation. (A) Expression of AAV5-DIO-ChR2-YFP after 4 weeks of injection. MEC layer III pyramidal neurons that project their axons from dorsal MEC to dorsal CA1. Dashed lines: ori, stratum oriens; pry, stratum pyramidale; rad, stratum radiatum; mol, stratum lacunosum moleculare. (B) Representative spike recording from one of the tetrodes. (a) 2D cluster projections of spikes recorded from the tetrode. (b) Examples of the average spike waveform of three clusters, which are indicated by dashed lines in (a). (C) Representative spike recording from one of the silicon-probe electrode sites. (a) 2D cluster projections of spike principal components. (b) Examples of the average spike waveform of three clusters. Spike clusters (pink and green) are separated from the noise clusters (blue). The clusters in (B,C) are calculated using KlustaKwik software. (D) Traces of spontaneous LFPs simultaneously recorded from the tetrodes in CA1 (a) and the silicon probe in MEC (b). Black arrows indicate the tetrode shown in (B) and silicon-probe electrode site shown in (C). (E) LFP responses to pulsed optical stimulation (10.6 mW, 1 ms; filled red arrowhead) from the tetrodes in CA1 (a) and silicon probe in MEC (b). Please click here to view a larger version of this figure.
| grams/one | number | sum [gram] |
| main body | 1.25 | 1 | 1.25 | |
| shuttle | 0.04 | 1 | 0.04 | |
| probe connecter mount | 0.19 | 1 | 0.19 | |
| fiber ferrule holder | 0.1 | 1 | 0.1 | |
| shielding cone | 1.82 | 1 | 1.82 | (0.72)* |
| conductive paste | 0.2 | 1 | 0.2 | |
| machine screw (#00, 2 mm), to hold EIB | 0.05 | 2 | 0.1 | |
| machine screw (#0-80, 3.5 mm) | 0.06 | 4 | 0.24 | |
| machine screw (#0-80, 6mm) | 0.09 | 2 | 0.18 | |
| nut | 0.03 | 2 | 0.06 | |
| microdrive (tetrode) | 0.05 | 9 | 0.45 | |
| microdrive (silicon probe) | 0.29 | 1 | 0.29 | |
| silicon probe | 0.28 | 1 | 0.28 | |
| electric interface board | 0.6 | 1 | 0.6 | |
| total | | | 5.8 | (4.7)* |
Table 1: Individual weight of each microdrive array part. The total weight of the microdrive array was 5.9 g after fixing the protective cone with epoxy (*in the case of using an alternative shielding cone using a paper and aluminum tape).
| procedures | time |
| microdrive preparation | |
| 3D parts printing | 1 day |
| optrode preparation | |
| Prepare the mold for the microdrive head | 1 day* |
| Microdrive head preparation | 3 h |
| Attaching an optical fiber | 3 h |
| Attaching a shuttle | 3 h |
| tetrode preparation | |
| Prepare the mold for the microdrive head | 1 day* |
| Microdrive heads preparation | 3 h |
| Loading tetrode wires | 1 day |
| Attaching the shielding cone | |
| Painting shielding paint | overnight* |
| Attaching to the microdrive body | 3 h |
| * these procedure can be conducted in parallel |
Table 2: The timeline of the microdrive preparation. The 3D-parts printing, waiting for curing the silicone rubber/dental acrylic/epoxy, and loading the tetrode wires take the majority of the time of the microdrive array preparation, in total 4-5 days.
Supplementary Files: The supplementary files include 3D model data of five microdrive parts in both .sldprt and .stl format. The original 3D model files were created with the software Solidworks2003. Please click here to download this file.