Understanding of the mechanical behavior of microelectromechanical systems (MEMS) devices is crucial for device design, performance, and reliability1,2. Conventional universal testing machines have been widely used to evaluate mechanical properties; however, they are expensive and require substantial space, manpower, and resources for installation, maintenance, and operation3. Moreover, because they were primarily designed for high force and large displacement ranges in the mechanical testing of high-strength materials, there are significant discrepancies between their measurement ranges and those required for evaluating the mechanical properties of microstructures in the small-strain region4. Therefore, research is needed on a new low-cost compression testing apparatus and experimental method applicable at the laboratory scale with high repeatability that can yield reliable measurements in the small-strain/small-force region5.
Several mechanical testing devices that can be utilized at the laboratory scale have been developed to characterize the mechanical properties of small-scale MEMS devices6,7,8. However, most of these devices were developed for testing high-strength materials or for specialized environments, and therefore they have limitations in reliably measuring the mechanical properties of MEMS structures in the small-strain/small-force region9,10.
To overcome these limitations, we propose a small-displacement compression testing system and method that can be utilized in even small-scale laboratories. The proposed method enables the quantitative evaluation of a material's mechanical behavior by simultaneously measuring small displacements and forces during the compression process. The system operates within a 4.4 N force range and a controlled displacement speed of 1 µm/s, ensuring precise and stable measurements. The system is a compact, low-cost compression testing setup designed to evaluate the mechanical properties of microstructures in the small-strain region.
This system integrates a z-stage with a force sensor and microcontroller board-based signal acquisition, enabling simultaneous measurement of force and displacement with high precision. System validation was performed through feedback resistor (RF) calibration-the key factor in determining the gain of the inverting amplifier circuit-and verification of vertical displacement using a laser displacement meter, confirming that the displacement and force measurement resolutions were 1 µm and 0.01 N, respectively. Scaled-down samples11,12, with one-third of the standard size (American Society for Testing and Materials (ASTM) D575-91, Standard Test Methods for Rubber Properties in Compression)13, were fabricated, and a compression test method was derived to evaluate the mechanical properties of microstructures reliably in the small-displacement/low-force region14,15.
The stress-strain curves of the scaled samples were measured with both a commercial universal testing machine (MTS) and the developed measurement system (MS), and the results were compared. From the slope of the initial linear region, the compressive modulus was determined to be 1.39 MPa, which showed a +5.3% deviation from values previously reported in the literature16. This measurement approach, which combines displacement control and force measurement17,18, provides a reproducible measurement framework suitable for MEMS and bio-MEMS applications. This approach not only provides a reliable framework for understanding the mechanical behavior of microstructures but also offers a practical method for evaluating materials in various fields, including biomedical devices19 and soft robotics20.