Nanoparticle Ink
Nanoparticle Ink - Related Videos
10:49
Planar and Three-Dimensional Printing of Conductive Inks
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Cited by 58 •
2011
Planar and three-dimensional printing of conductive metallic inks is described. Our approach provides new avenues for fabricating printed electronic, optoelectronic, and biomedical devices in unusual layouts at the microscale.
03:07
India Ink Inflation: A Staining Method to Visualize Tumor Nodules
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2023
This video describes india ink inflation--a staining method--to quantify tumor nodules in tumor-bearing mouse lungs. After staining, the lungs are fixed in Fekete's solution to observe tumor nodules in the lungs.
13:16
Intravascular Perfusion of Carbon Black Ink Allows Reliable Visualization of Cerebral Vessels
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Cited by 16 •
2013
Analysis of rodent cerebrovascular anatomy plays an important role in experimental stroke research. In this context, intravascular perfusion with colored latex has been considered as a standard tool for several years. However, this technique implies distinct technical limitations, which undermine its reproducibility. Here, we describe a simple method to visualize cerebral vessels in a reproducible manner. Injection of a mixture of two commercially available carbon black inks through the left...
10:31
Diffuse Reflectance Infrared Spectroscopic Identification of Dispersant/Particle Bonding Mechanisms in Functional Inks
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Cited by 11 •
2015
Formulation of stable, functional inks is critical to expanding the applications of additive manufacturing. In turn, knowledge of the mechanisms of dispersant/particle bonding is required for effective ink formulation. Diffuse Reflectance Fourier Transform Infrared Spectroscopy (DRIFTS) is presented as a simple, inexpensive way to gain insight into these mechanisms.
09:23
Harmonic Nanoparticles for Regenerative Research
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Cited by 1 •
2014
Protocol details are provided for in vitro labeling human embryonic stem cells with second harmonic generating nanoparticles. Methodologies for hESC investigation by multi-photon microscopy and their differentiation into cardiac clusters are also presented.
FAQs
The carrier first keeps the nanoscale particles mobile during deposition. Once the patterned liquid reaches the substrate, drying removes that carrier and leaves the particles in place. A subsequent thermal or photonic sintering step joins neighboring particles into a continuous functional film, giving the printed feature material continuity for engineered device structures.
Sintering transforms a deposited particle pattern into a more continuous film. Thermal sintering uses heat, whereas photonic sintering uses light-based energy, and both are identified as post-deposition options for joining the particles. Selecting either approach allows the deposited material to develop the continuity needed for traces, sensors, antennas, and related components.
Inkjet and aerosol deposition are two routes for placing the formulation onto a substrate in controlled patterns. The overview does not assign one universal advantage to either method, but their inclusion shows that nanoparticle materials can be adapted to different deposition approaches. This flexibility supports patterned fabrication across rigid and flexible engineering substrates.
A typical workflow places the formulation on a selected rigid or flexible substrate through inkjet or aerosol deposition. The deposited pattern then dries as the carrier is removed. Finally, thermal or photonic sintering joins the particles into a continuous film, producing the functional patterned material required for the intended component.
Printed conductive traces, sensors, antennas, and other components are identified applications. These structures can be formed on rigid or flexible substrates, making the approach relevant to printed electronics and device fabrication. Its ability to create controlled patterns also supports rapid prototyping and the development of components through additive manufacturing rather than relying only on bulk material processing.
Its tunable composition allows the formulation to be matched to different deposited structures and device needs, while controlled placement limits unnecessary material use. Combined with additive fabrication, this can support low-material-waste production, rapid prototyping, and scalable manufacturing of printed electronic devices on both rigid and flexible substrates.