Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

6.8K views

09:06 min

July 3rd, 2020

10.3791/61468-v

July 3rd, 2020

6.8K views

An experimental methodology based on thermal and rheological measurements is proposed to characterize the curing process of adhesives with to obtain useful information for industrial adhesive selection.

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Adhesive Curing

Chapters in this video

0:05

Introduction

0:41

Manufacturer Curing Condition Checking: Thermogravimetric Cured Sample Testing

1:20

Manufacturer Curing Condition Checking: Differential Scanning Calorimetry (DSC) of a Cured Sample

2:29

DSC Fresh Sample Analysis: Ramp Curing Test

3:23

DSC Fresh Sample Analysis: Isothermal Curing Test

4:47

Logarithmic Strain Sweep Test

5:27

Isothermal Multifrequency Curing Test

6:22

Torque sweep and Temperature Scan Testing

7:18

Results: Representative Cured Adhesive System Rheological and Thermal Testing

8:42

Conclusion

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