Ultra High Vacuum
Ultra High Vacuum - Related Videos
08:53
Angle-resolved Photoemission Spectroscopy At Ultra-low Temperatures
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Cited by 8 •
2012
The overall goal of this method is to determine the low-energy electronic structure of solids at ultra-low temperatures using Angle-Resolved Photoemission Spectroscopy with synchrotron radiation.
06:20
Proper Operation of Vacuum Based Equipment
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2023
Source: Robert M. Rioux, Ajay Sathe & Zhifeng Chen, Pennsylvania State University, University Park, PA Vacuum is required for a number of laboratory procedures. This is most routinely achieved in the laboratory by the use of vacuum pumps. In addition to working at low pressures, vacuum pumps can also be used to enable rapid changing of the atmospheres in a reactor or flask by evacuation and backfilling.
05:28
MALDI Sample Preparation: the Ultra Thin Layer Method
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Cited by 32 •
2007
This video demonstrates the preparation of an ultra-thin matrix/analyte layer for analyzing peptides and proteins by Matrix-Assisted Laser Desorption Ionization Mass Spectrometry (MALDI-MS).
03:03
Generating an Ultra-Low-Density Neuronal Culture Using a High-Density Neuronal Feeder Layer
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2025
This video demonstrates the method for culturing ultra-low-density neurons in the presence of a high-density neuronal feeder layer. It establishes a co-culture of varying-density neurons, ensuring close physical proximity. The growth factors secreted by high-density neurons help neuronal survival and growth, maintaining ultra-low-density neurons for a longer time period.
05:04
Determining the Mechanical Strength of Ultra-Fine-Grained Metals
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2021
The protocol presented here describes the high-pressure radial diamond-anvil-cell experiments and analyzing the related data, which are essential for obtaining the mechanical strength of the nanomaterials with a significant breakthrough to the traditional approach.
FAQs
Lowering the pressure reduces the number of gas molecules available to collide with surfaces, particle beams, or electrons. That reduction limits scattering and unwanted contamination, allowing instruments to control trajectories and surface conditions more precisely. The result is improved measurement accuracy and more reproducible processing, especially when a small change at a surface or in a beam matters.
A UHV installation may combine mechanical, turbomolecular, and ion pumping rather than relying on one pump type. Staging the pumping approach helps remove gas while supporting the very low pressures required for controlled experiments. Pump selection is therefore part of system engineering: it must work with the chamber, its materials, and the process being protected from residual gas.
Low-outgassing materials reduce the gas released from chamber components into the evacuated space. Elevated-temperature bakeout removes adsorbed gases before operation, helping the system reach and maintain its target pressure. These choices are important because a leak-tight design alone does not eliminate gas originating from surfaces or components inside the chamber.
Vacuum gauges measure pressure, while residual-gas analysis examines the remaining gas composition. Used together, they let engineers distinguish overall pressure performance from the presence of particular residual gases. This monitoring supports diagnosis and process control, helping determine whether the chamber is clean and stable enough for surface studies, beam instruments, or thin-film work.
An engineered setup begins with a leak-tight chamber made from low-outgassing materials, followed by staged pumping with suitable mechanical, turbomolecular, or ion pumps. Engineers can then apply elevated-temperature bakeout to remove adsorbed gases and use vacuum gauges plus residual-gas analysis to verify performance. This sequence links construction, gas removal, conditioning, and measurement rather than treating vacuum as a single operation.
Applications span semiconductor fabrication, surface science, electron and ion beam instruments, particle accelerators, and space-environment simulation. In each case, the controlled environment addresses a different engineering need: limiting contamination during fabrication, preserving surface conditions for characterization, reducing beam scattering, or reproducing low-gas surroundings. These uses make UHV a platform technology for reliable devices and experimental systems.