Sputter Deposition
Sputter Deposition - Related Videos
08:23
Niobium Oxide Films Deposited by Reactive Sputtering: Effect of Oxygen Flow Rate
0 Views •
Cited by 8 •
2019
Here, we present a protocol for niobium oxide films deposition by reactive sputtering with different oxygen flow rates for use as an electron transport layer in perovskite solar cells.
10:07
Improving Thermoelectric Properties of Bi2Te3 Thin Films By Manganese Co-Sputtering
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2026
A radiofrequency co-sputtering protocol was developed to fabricate manganese-doped Bi2Te3 thin films and evaluate how manganese input influences structural and thermoelectric transport properties. Moderate manganese incorporation improved film uniformity and power-factor-related transport behavior, while higher manganese input increased structural disorder and resistivity.
12:20
Sputter Growth and Characterization of Metamagnetic B2-ordered FeRh Epilayers
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Cited by 23 •
2013
A method to prepare epitaxial layers of ordered alloys by sputtering is described. The B2-ordered FeRh compound is used as an example, as it displays a metamagnetic transition that depends sensitively on the degree of chemical order and the exact composition of the alloy.
14:01
Making Record-efficiency SnS Solar Cells by Thermal Evaporation and Atomic Layer Deposition
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Cited by 30 •
2015
Tin sulfide (SnS) is a candidate material for Earth-abundant, non-toxic solar cells. Here, we demonstrate the fabrication procedure of the SnS solar cells employing atomic layer deposition, which yields 4.36% certified power conversion efficiency, and thermal evaporation which yields 3.88%.
12:05
U2O5 Film Preparation via UO2 Deposition by Direct Current Sputtering and Successive Oxidation and Reduction with Atomic Oxygen and Atomic Hydrogen
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Cited by 1 •
2019
This protocol presents the preparation of U2O5 thin films obtained in situ under ultra-high vacuum. The process involves oxidation and reduction of UO2 films with atomic oxygen and atomic hydrogen, respectively.
FAQs
The plasma supplies the energetic argon ions needed to bombard the target. During collisions, momentum transfer ejects target atoms, which then cross the gas phase and condense at the substrate. This sequence links electrical energy input to material removal and film growth. Maintaining the vacuum environment allows this transfer to occur in a controlled chamber.
Changing chamber pressure, applied power, or substrate temperature can alter film thickness, structure, adhesion, and properties. These variables serve as engineering controls for tuning the deposited layer to its intended function. Careful adjustment becomes important when the same deposition approach must produce conductive, optical, protective, or wear-resistant surfaces.
The target supplies the material that becomes the coating, so its composition is central to the film's resulting characteristics. Selecting different target compositions allows engineers to pursue conductive, optical, protective, or wear-resistant behavior, depending on the surface requirement. This choice connects the source material directly to coating design in electronics, sensors, energy devices, tools, and other engineered surfaces.
A basic workflow places a solid target and substrate inside a vacuum chamber, establishes the plasma-forming environment, and energizes the plasma so ions bombard the target. Ejected atoms then travel through the gas phase and condense on the substrate. During deposition, pressure, power, and substrate temperature can be adjusted to control film thickness, structure, adhesion, and properties.
Engineers choose Sputter Deposition when a component needs a controlled thin film rather than only a bulk material change. Its applications include coatings for electronics, sensors, energy devices, tools, and other engineered surfaces, as well as microfabrication. Depending on the selected target and operating conditions, the resulting layer can provide conductive, optical, protective, or wear-resistant functionality.
Film thickness, structure, adhesion, and properties are the main outcomes that reveal how successfully the process produced an engineered layer. Thickness describes the amount of deposited material, while structure, adhesion, and other properties characterize the layer more broadly. Reviewing these outcomes helps connect processing conditions with the intended conductive, optical, protective, or wear-resistant application.