芯片尺寸支架的三维细胞培养的微细

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09:37 min

May 12th, 2008

10.3791/699-v

May 12th, 2008

11.4K views

我们提出了两个过程的三维细胞培养的微细多孔聚合物芯片。第一个是与溶剂蒸气的焊接工艺相结合的热压。第二个使用最近开发microthermoforming过程中,结合离子跟踪技术,导致生产的一个显着简化。

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Microfabrication

Chapters in this video

0:01

Introduction

0:39

Hot Embossing I: Moulding procedure

3:05

Hot Embossing II: Trimming and milling

4:05

Bonding of a microporous membrane to the back of the microcontainers

5:11

SMART: Substrate Modification And Replication by Thermoforming

5:16

SMART Technology I: Irradiation

8:27

SMART Technology III: Track Etching

6:19

SMART Technology II: Microthermoforming

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