用于柔性、可靠键合的简易硅胶芯片-膜密封方法
818 次观看
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06:10 分钟
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2026年3月20日
DOI :10.3791/69980-v
2026年3月20日
•818 次观看
1Department of Pathology and Medical Biology, EXPIRE Lab, University of Groningen, University Medical Center Groningen, 2GRIAC Research Institute, University of Groningen, University Medical Center Groningen, 3Department of Biomaterials and Biomedical Technology, University Medical Center Groningen, University of Groningen, 4Tissue Engineering and Cells Therapy Group (GITTC), School of Medicine, University of Antioquia, Alma Mater Hospital of Antioquia, 5Department of Pulmonary Diseases, University Medical Center Groningen, University of Groningen
一种新型密封方案，用于在聚二甲基硅氧烷（PDMS）芯片装置的膜上制备防水的硅胶密封。适用于建立芯片模型和小规模芯片平台开发的实验室。我们以塑料和天然组织膜为例演示了该方案。此操作仅需PDMS、甲苯、模具、膜和真空腔室。
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Chapters in this video
0:00
Introduction
0:29
PDMS Chip-Half Production
1:33
Membrane Preparation
2:04
Membrane Bonding
4:04
Results
5:45
Conclusion
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