Secondary Electron Imaging
Secondary Electron Imaging - Related Videos
06:10
Live Imaging of Mouse Secondary Palate Fusion
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Cited by 11 •
2017
Here, we present a protocol for live imaging of mouse secondary palate fusion using confocal microscopy. This protocol can be used in combination with a variety of fluorescent reporter mouse lines, and with pathway inhibitors for mechanistic insight. This protocol can be adapted for live imaging in other developmental systems.
07:50
Electron Channeling Contrast Imaging for Rapid III-V Heteroepitaxial Characterization
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Cited by 22 •
2015
The use of electron channeling contrast imaging in a scanning electron microscope to characterize defects in III-V/Si heteroexpitaxial thin films is described. This method yields similar results to plan-view transmission electron microscopy, but in significantly less time due to lack of required sample preparation.
03:25
Imaging of Neuronal Mitochondria Using a Serial Block-Face Scanning Electron Microscope
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2025
Source: Mukherjee, K., et. al. Analysis of Brain Mitochondria Using Serial Block-Face Scanning Electron Microscopy. J. Vis. Exp. (2016)This video demonstrates the preparation, imaging, and analysis of mouse brain tissue using a serial block-face scanning electron microscope (SBFSEM) to visualize mitochondrial ultrastructure, enabling precise mapping of their morphology and spatial distribution in axonal and dendritic neuronal compartments.
08:01
Rapid Scan Electron Paramagnetic Resonance Opens New Avenues for Imaging Physiologically Important Parameters In Vivo
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Cited by 11 •
2016
A new electron paramagnetic resonance (EPR) method, rapid scan EPR (RS-EPR), is demonstrated for 2D spectral spatial imaging which is superior to the traditional continuous wave (CW) technique and opens new venues for in vivo imaging. Results are demonstrated at 250 MHz, but the technique is applicable at any frequency.
09:40
A Scanning Electron Microscopy-Compatible Optical Imaging Method for Mesoscopic All-Cell Brain Mapping
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2026
We introduced a novel imaging technique called Optical Multilayer Interference Tomography (OMLIT), which enables unbiased imaging of all cells in brain specimens at the mesoscale and can be seamlessly integrated into the imaging workflow of tape-based serial scanning electron microscopy on the same sample.
FAQs
Contrast in Secondary Electron Imaging is governed by how readily near-surface regions contribute detected electrons as the beam scans. Ridges, edges, and textured areas can produce stronger or changing signals than comparatively flat regions, so brightness variations map local surface form. This makes the technique especially informative for fine morphological features.
The low-energy signal comes from only a near-surface region, which limits the image’s sensitivity to material buried beneath the exterior. As a result, Secondary Electron Imaging emphasizes surface condition rather than internal structure. In engineering examinations, that surface weighting helps distinguish morphology, roughness, edge features, and wear-related changes.
Signal variations become scientifically useful when interpreted alongside the specimen’s processing and performance history. A visible texture, defect, or wear feature can provide evidence for how fabrication conditions shaped the surface and how that microstructure may relate to mechanical performance. This supports analysis connecting processing conditions, near-surface structure, and engineering behavior.
An examination proceeds by directing a focused primary electron beam across the specimen in a controlled scan, while a detector collects the secondary electrons released from the scanned locations. The system converts changing detector intensity into image contrast. Reviewing those patterns then allows investigators to assess surface morphology and fine structural detail.
For engineering materials, the technique can be applied to coatings, microfabricated devices, and fractured components as well as broader material surfaces. Each application uses surface-sensitive contrast to inspect a different engineering concern, such as coating condition, device morphology, or fracture-surface detail. The observations help organize targeted evaluation of component condition.
Secondary Electron Imaging supports defect identification, surface-roughness characterization, and wear assessment. These observations can be compared with processing conditions to investigate why a feature developed, or with mechanical-performance results to examine its engineering significance. The method therefore provides a visual link between near-surface morphology and the behavior of manufactured or failed components.