Photolithography Assisted
Photolithography Assisted - Related Videos
07:44
Microfabrication via Photolithography
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2023
The fabrication of BioMEM devices is often done using a microfabrication technique called photolithography. This widely used method utilizes light to transfer a pattern onto a silicon wafer, and provides the basis for the fabrication of many types of BioMEM devices. This video presents the photolithography technique, shows how the process is performed in the cleanroom, and introduces some applications of the process.
10:18
Multi-step Variable Height Photolithography for Valved Multilayer Microfluidic Devices
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Cited by 26 •
2017
Multilayer microfluidic devices often involve the fabrication of master molds with complex geometries for functionality. This article presents a complete protocol for multi-step photolithography with valves and variable height features tunable to any application. As a demonstration, we fabricate a microfluidic droplet generator capable of producing hydrogel beads.
08:15
Polymeric Microneedle Array Fabrication by Photolithography
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Cited by 24 •
2015
Here, we present a protocol describing a mold-free fabrication process of the polymeric microneedles by photolithography.
16:06
Fabrication of Micropatterned Hydrogels for Neural Culture Systems using Dynamic Mask Projection Photolithography
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Cited by 46 •
2011
Simple techniques are described for the rapid production of microfabricated neural culture systems using a digital micromirror device for dynamic mask projection lithography on regular cell culture substrates. These culture systems may be more representative of natural biological architecture, and the techniques described could be adapted for numerous applications.
08:34
Robot-assisted Partial Splenectomy
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2026
This protocol describes a robot-assisted partial splenectomy for a benign splenic tumor. The robotic approach optimizes spleen preservation by enhancing surgical precision, minimizing blood loss, and improving postoperative outcomes. Key surgical steps include meticulous splenic hilum dissection, selective vascular ligation, intraoperative ultrasonography, and controlled parenchymal transection.
FAQs
The photomask separates regions that receive ultraviolet exposure from regions that remain shielded. This spatial selection determines which portions of the photoresist change during exposure and therefore which areas development removes. Because the mask encodes the intended pattern, its geometry directly influences the dimensions and surface structure reproduced on the substrate.
Photoresist behavior depends on how the light-sensitive material responds to ultraviolet exposure. In one configuration, development removes exposed regions; in another, it removes unexposed regions. This distinction changes which parts of the substrate remain protected for later processing, allowing the same patterning approach to support different material-transfer strategies.
Development creates a patterned resist layer, but the underlying substrate or material still has to acquire that geometry. Etching removes selected underlying material through the openings, whereas deposition adds material in regions defined by the pattern. These transfer steps convert the temporary resist image into a physical structure suitable for a microscale device.
A typical workflow begins by coating a substrate with photoresist, placing a photomask to define the desired pattern, and exposing selected regions to ultraviolet light. Development then removes either the exposed or unexposed resist. Finally, etching or deposition transfers the remaining pattern into the underlying material, producing the intended microscale geometry.
The essential components are a substrate, a light-sensitive photoresist, a photomask, and an ultraviolet exposure source. Development creates the patterned resist, while etching or deposition acts on the underlying material. Together, these components provide the sequence needed to convert a designed mask pattern into controlled surface features.
The approach is useful when devices require repeatable patterning, precise geometry, or controlled surface structure at microscale dimensions. The overview identifies semiconductor manufacturing, microelectromechanical systems, microfluidic devices, and sensors as important applications. In each case, transferring a defined pattern into a material supports fabrication of structures whose dimensions must remain consistent.