Scanning Electron Microscope
Scanning Electron Microscope - Related Videos
03:25
Imaging of Neuronal Mitochondria Using a Serial Block-Face Scanning Electron Microscope
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2025
Source: Mukherjee, K., et. al. Analysis of Brain Mitochondria Using Serial Block-Face Scanning Electron Microscopy. J. Vis. Exp. (2016)This video demonstrates the preparation, imaging, and analysis of mouse brain tissue using a serial block-face scanning electron microscope (SBFSEM) to visualize mitochondrial ultrastructure, enabling precise mapping of their morphology and spatial distribution in axonal and dendritic neuronal compartments.
11:14
Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
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Cited by 4 •
2016
The optical, electrical, and structural properties of dislocations and of grain boundaries in semiconductor materials can be determined by experiments performed in a scanning electron microscope. Electron microscopy has been used to investigate cathodoluminescence, electron beam induced current, and diffraction of backscattered electrons.
11:41
Scanning Electron Microscopy (SEM)
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2023
Source: Laboratory of Dr. Andrew J. Steckl — University of Cincinnati A scanning electron microscope, or SEM, is a powerful microscope that uses electrons to form an image. It allows for imaging of conductive samples at magnifications that cannot be achieved using traditional microscopes. Modern light microscopes can achieve a magnification of ~1,000X, while typical SEM can reach magnifications of more than 30,000X. Because the SEM doesn’t use light to create images, the resulting pictures it...
07:00
Preparing Lamellae from Vitreous Biological Samples Using a Dual-Beam Scanning Electron Microscope for Cryo-Electron Tomography
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Cited by 8 •
2021
Using focused ion beam milling to produce vitreous on-grid lamellae from plunge frozen biological samples for cryo-electron tomography.
10:53
Scanning-probe Single-electron Capacitance Spectroscopy
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2013
Scanning-probe single-electron capacitance spectroscopy facilitates the study of single-electron motion in localized subsurface regions. A sensitive charge-detection circuit is incorporated into a cryogenic scanning probe microscope to investigate small systems of dopant atoms beneath the surface of semiconductor samples.
FAQs
Secondary and backscattered electrons offer complementary evidence from the same scan. Secondary-electron signals help expose fine surface relief, while backscattered-electron signals help distinguish regions that differ in material composition. Detectors collect these emissions and convert their variations into image contrast. Comparing the resulting patterns lets engineers separate physical surface features from composition-related differences when characterizing a specimen.
Raster scanning organizes the examination by moving the focused electron beam across the specimen in a controlled pattern. At each location, electron-matter interactions generate detectable signals, and the instrument assigns their measured variations to corresponding image positions. This preserves spatial information, allowing engineers to relate contrast to specific surface regions, defects, or material differences rather than viewing an undifferentiated signal.
Resolution determines how finely separated features can be distinguished, whereas depth of field describes how much of the specimen surface remains sharply represented across different elevations. Together, these characteristics are especially useful for examining intricate engineering surfaces. High detail supports nanoscale structural assessment, while substantial depth of field helps preserve an interpretable image of uneven topography.
Engineers can apply SEM to failure analysis when they need detailed visual evidence of surface structure, defects, or composition-related differences. The method can support investigations of damaged metals, ceramics, polymers, and electronic components, helping connect observed features with material performance or manufacturing reliability. It is therefore useful for examining a failed part and identifying evidence relevant to process improvement.
The source material identifies metals, ceramics, polymers, and electronic components as engineering subjects for SEM characterization. Across these categories, imaging can reveal surface structure, composition-related contrast, and defects. That range makes the instrument relevant to material studies and component-level investigations, including work aimed at understanding performance variations or checking whether manufactured features meet quality expectations.
In corrosion studies, SEM provides detailed evidence of affected surface structure and defects. In microfabrication, its high resolution helps inspect small manufactured features, while quality-control teams can use images to assess structural consistency and identify imperfections. These applications extend beyond observation: the resulting surface and composition information can guide material-performance evaluations and decisions about manufacturing reliability.