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Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers

Article DOI: 10.3791/61040-v • 09:18 min • February 8th, 2022
February 8th, 2022 •
1, 1, 1, 1
1The Polytechnic School, Arizona State University

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A protocol for metal-assisted chemical imprinting of 3D microscale features with sub-20 nm shape accuracy into solid and porous silicon wafers is presented.

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Metal-Assisted Electrochemical Nanoimprinting Porous Silicon Solid Silicon Wafers Three-dimensional Hierarchical Microstructures Metasurface-based Microoptic Elements Waveguide Technologies Replication Of 3D Structures Polymeric Molds Hard Molds Monocrystalline Silicon Wafers Sub 100 Nanometer Resolutions Optical Biosensors Infrared Optical Devices Group III-V Semiconductors Stamp To Substrate Tip Alignment Uniform Mac-imprint RCA-1 Solution Silicon Master Mold Plastic Petri Dish Desiccator PFOCS
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