Lithographic Patterning
Lithographic Patterning - Related Videos
12:38
Soft Lithographic Functionalization and Patterning Oxide-free Silicon and Germanium
0 Views •
Cited by 3 •
2011
Here we describe a simple method for patterning oxide-free silicon and germanium with reactive organic monolayers and demonstrate functionalization of the patterned substrates with small molecules and proteins. The approach completely protects surfaces from chemical oxidation, provides precise control over feature morphology, and provides ready access to chemically discriminated patterns.
08:19
Patterning via Optical Saturable Transitions - Fabrication and Characterization
0 Views •
Cited by 1 •
2014
We report that the diffraction limit of conventional optical lithography can be overcome by exploiting the transitions of organic photochromic derivatives induced by their photoisomerization at low light intensities.1-3 This paper outlines our fabrication technique and two locking mechanisms, namely: dissolution of one photoisomer and electrochemical oxidation.
13:02
Microfabrication of Nanoporous Gold Patterns for Cell-material Interaction Studies
0 Views •
Cited by 16 •
2013
We report on techniques to micropattern nanoporous gold thin films via stencil printing and photolithography, as well as methods to culture cells on the microfabricated patterns. In addition, we describe image analysis methods to characterize morphology of the material and the cultured cells using scanning electron and fluorescence microscopy techniques.
08:36
Creating Two-Dimensional Patterned Substrates for Protein and Cell Confinement
0 Views •
Cited by 5 •
2011
Self-assembled monolayers (SAMs) formed from long chain alkane thiols on gold provide well-defined substrates for the formation of protein patterns and cell confinement. Microcontact printing of hexadecanethiol using a polydimethylsiloxane (PDMS) stamp followed by backfilling with a glycol-terminated alkane thiol monomer produces a pattern where protein and cells adsorb only to the stamped hexadecanethiol region.
10:26
Soft Lithographic Procedure for Producing Plastic Microfluidic Devices with View-ports Transparent to Visible and Infrared Light
0 Views •
Cited by 1 •
2017
A protocol for the fabrication of plastic microfluidic devices with transparent view-ports for visible and infrared light imaging is described.
FAQs
Pattern formation depends on selective resist processing. A mask or focused beam determines where the resist-coated substrate is exposed, and development then removes or retains selected regions. This creates a patterned resist layer that acts as the immediate guide for later material processing. The sequence matters because the resist pattern connects the designed geometry to the substrate-level structure.
Resolution, alignment, feature size, and material compatibility are central controls. Resolution determines how finely designed structures can be reproduced, while alignment governs how accurately features correspond. Feature size affects device geometry, and compatibility between the resist, substrate, and downstream processing helps preserve the intended pattern during fabrication.
Both supply the exposure step, but they create patterns through different delivery approaches: one uses a mask and the other directs a focused beam. The choice changes how the designed geometry reaches the resist-coated surface. In engineering, comparing these approaches helps match pattern formation with required feature size, alignment, and material compatibility.
Development produces selected resist openings or retained regions, but the underlying material still needs to receive the pattern. Etching, deposition, or lift-off performs that transfer into or onto the substrate. Distinguishing these stages helps engineers diagnose whether a result reflects exposure and development or a later material-transfer step.
A typical sequence coats the substrate with resist, exposes selected regions through a mask or focused beam, and develops the surface so regions are removed or retained. Engineers then apply etching, deposition, or lift-off to transfer the design into the underlying material. This staged approach separates pattern formation from material transfer.
Its applications include integrated circuits, sensors, microfluidic systems, and photonic components. In each case, controlled feature geometry supports the construction of structured device elements at microscale or nanoscale dimensions. The method therefore contributes to miniaturization across different engineering platforms, although the relevant pattern, substrate, and material-compatibility requirements can vary by device.
Pattern quality influences whether the fabricated structure matches the designed feature size and alignment. Those geometric controls matter because integrated circuits, sensors, microfluidic systems, and photonic components depend on engineered structures to function as intended. Managing resolution alongside material compatibility can therefore support improved performance while preserving the ability to miniaturize devices.