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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding

Article DOI: 10.3791/51179-v • 10:32 min • January 9th, 2014
January 9th, 2014 •
1, 2,3, 4, 5, 1
1Department of Physics, The State University of New York at Buffalo, 2Joint Quantum Institute, University of Maryland, 3The National Institute of Standards and Technology, 4Cryogenics and Fluids Branch, NASA Goddard Space Flight Center, 5HRL Laboratories

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A method for permanently bonding two silicon wafers so as to realize a uniform enclosure is described. This includes wafer preparation, cleaning, RT bonding, and annealing processes. The resulting bonded wafers (cells) have uniformity of enclosure ~1%1,2. The resulting geometry allows for measurements of confined liquids and gasses.

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Nanoscale Cavities Silicon Direct Wafer Bonding Heat Capacity Superfluid Fraction Lithographically Patterned Bonded Silicon Wafers Uniform Spaces For Confinement Predesigned Uniform Spaces Interpretation Of Data Flat Si Wafers Thermal Oxide Confinement Dimension Lithographic Techniques Desired Enclosure Introduction Of The Liquid Cleaning Process Strong And Permanent Bond Measuring Thermal And Hydrodynamic Properties
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