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Journal / Engineering / Laser-induceret Forward Transfer for Flip-chip…
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JoVE Journal Engineering
Laser-induceret Forward Transfer for Flip-chip Pakning af Single Dies
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Laser-induceret Forward Transfer for Flip-chip Pakning af Single Dies

Article DOI: 10.3791/52623-v • 08:21 min • March 20th, 2015
March 20th, 2015 •
1, 1
1Center for Microsystems Technology (CMST), Ghent University-imec

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Vi demonstrere brugen af ​​Laser-induceret Forward Transfer (LIFT) teknik til flip-chip samling af optoelektroniske komponenter. Denne fremgangsmåde giver en enkel, omkostningseffektiv, lav temperatur, hurtig og fleksibel løsning for fine pitch bumpe og limning på chip-skala for at opnå høj tæthed kredsløb til optoelektroniske applikationer.

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Fysik LIFT direkte-write flip-chip sammenkoblinger indium mikro-bump termo-kompression VCSEL
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