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JoVE Journal Engineering
Evaluación del curado de sistemas adhesivos mediante ensayos reológicos y térmicos
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Evaluación del curado de sistemas adhesivos mediante ensayos reológicos y térmicos

Article DOI: 10.3791/61468-v • 09:06 min • July 3rd, 2020
July 3rd, 2020 •
*1, *1, *1, *1, *1, *1
1Escola Politécnica Superior, Universidade da Coruña
* These authors contributed equally

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Se propone una metodología experimental basada en mediciones térmicas y reológicas para caracterizar el proceso de curado de adhesivos con el fin de obtener información útil para la selección de adhesivos industriales.

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Ingeniería Número 161 Adhesivos reología DSC curado polímeros transición de vidrio
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