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Bioengineering

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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
 
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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Article DOI: 10.3791/50735-v 07:51 min December 23rd, 2013
December 23rd, 2013

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In this article we describe different techniques for microfluidic rapid prototyping platforms. The proposed techniques are based on ultraviolet (UV) sensitive and temperature curing epoxies, polydimethylsiloxane (PDMS) based tubing, wire-bonding, and anisotropic adhesive films. The assembling procedures presented are developed for both one-time use devices as well as reusable microfluidic systems.

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High Throughput Microfluidic Rapid Low Cost Prototyping Packaging Methods One-time Use Reusable Packaging Techniques UV-based Curing Epoxies Temperature Curing Epoxies Microtubes Access Holes Wire-bonding Integrated Circuit Connections Silver Epoxy Electrical Connections Robust Assembly Technique High Pressure Psi Microfluidic Architecture PDMS-based Microtube Interconnectors Anisotropic Adhesive Films Plexiglas Support Sensitive Fragile Electrical Contact Micromanipulator Thin PDMS Layer Adherence Versus Injection Rates
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