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Placcatura in metallo composito senza bagno localizzata tramite elettrostamping
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Placcatura in metallo composito senza bagno localizzata tramite elettrostamping

Article DOI: 10.3791/61484-v • 08:05 min • September 22nd, 2020
September 22nd, 2020 •
*1, *1, *1, *2
1Department of Chemistry and Biochemistry, St. Mary's College of Maryland, 2PMA-265 Power and Propulsion IPTL
* These authors contributed equally

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Presentato qui è un protocollo di galvanica senza bagno, in cui una pasta di sale metallica stagnante contenente particelle composite viene ridotta per formare compositi metallici ad alto carico. Questo metodo affronta le sfide affrontate da altre forme comuni di galvanica (getto, pennello, bagno) di incorporare particelle composite nella matrice metallica.

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Chimica Numero 163 Galvanica Elettrostamping bathless composito film sottile rivestimento cella secca igroscopico placcatura nichel fosforo fluorescenza fosforescenza ossidi metallici
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