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Journal / Engineering / その場での透過型電子顕微鏡での時間依存絶縁破壊：マイクロエレクトロニクスデバイスの故障メカニズムを理…
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JoVE Journal Engineering
その場での透過型電子顕微鏡での時間依存絶縁破壊：マイクロエレクトロニクスデバイスの故障メカニズムを理解することが可能
Measurement of Coherence Decay in GaMnAs Using Femtosecond Four-wave Mixing
Journal (Engineering)
Measurement of Coherence Decay in GaMnAs Using Femtosecond Four-wave Mixing
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Journal (Engineering)
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
 
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その場での透過型電子顕微鏡での時間依存絶縁破壊：マイクロエレクトロニクスデバイスの故障メカニズムを理解することが可能

Article DOI: 10.3791/52447-v • 09:26 min • June 26th, 2015
June 26th, 2015 •
1,2, 1, 1,3, 1, 1, 1, 1, 1, 4, 4, 4, 1,2
1Fraunhofer Institute for Ceramic Technologies and Systems, 2Dresden Center for Nanoanalysis, Technische Universität Dresden, 3Globalfoundries Fab 8, 4Globalfoundries Fab 1

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工学、100号、時間依存絶縁破壊、信頼性、銅配線、分解速度、
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