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The remarkable electronic and chemical properties as well as its high mechanical strength have made silicon (Si) an ideal choice for microelectronic devices and biomedical chips1. Selective area control of the Si surface has received significant attention for applications involving microfluidic and lab-on-chip devices2,3.This is often obtained either by nano-scale modification of the surface roughness or by chemical treatment of the surface4. The surface roughening or patterning to produce disordered or ordered surface structures on the Si surface include photolithography5, ion beam lithography6 and laser techniques7. Compared with these methods, laser surface texturing process is reported to be less complicated with the potential to produce microstructures with high spatial resolution8. However, as Si has an elevated texturing threshold, requiring irradiation with pulse fluence to induce surface texturing in excess of its ablation threshold (~500 mJ/cm2)9, texturing of Si surface has frequently been assisted by employing reactive gas atmospheres, such as that of a high pressure SF6 environment4,7,8. Consequently, to modify wettability of the Si surface, numerous works have focused on chemical treatment by depositing organic10 and inorganic films2, or using plasma or electron beam surface treatment11,12. It is recognized that hydrophilicity of Si originating from the existence of singular and associated OH groups on its surface could be achieved by boiling it in a H2O2 solution at 100 °C for several minutes13. However, the hydrophobic Si surface states, most of which are due to the presence of Si-H or Si-O-CH3 groups, could be achieved by wet chemical handling involving etching with HF acid solution or coating with photoresist13-15. To achieve selective area control of wettability of Si, complex patterning steps are usually required, including treatment in chemical solutions16. The high chemical reactivity of UV laser radiation has also been used to selective area process organic film coated solid substrates and modify their wettability17. However, a limited amount of data is available on laser-assisted modification of Si wettability by irradiation of samples immersed in different chemical solutions.
In our previous research, UV laser irradiation of III-V semiconductors in air18-20 and NH321 was successfully used to alter the surface chemical composition of GaAs, InGaAs and InP. We established that UV laser irradiation of III-V semiconductors in deionized (DI) water decreases surface oxides and carbides, while the water adsorbed on semiconductor surface increases22. A strongly hydrophobic Si surface (CA~103°) was obtained by ArF laser irradiation of Si samples in methanol in our recent work 23. As indicated by X-ray photoelectron spectroscopy (XPS), this is primarily due to the ability of the ArF laser to photodissociate CH3OH. We have also used KrF and ArF lasers to irradiate Si (001) in a 0.01% of H2O2 in DI water. This allowed us to achieve selective area formation of superhydrophilic surface of Si (001) characterized by the CA of near 15°. The XPS results suggest that this is due to generation of Si-OH bonds on the irradiated surface24.
A detailed description of this new technique using KrF and ArF lasers for selective area in situ modification of the hydrophilic/hydrophobic surface of Si surface in low concentration of H2O2/H2O and methanol solutions is demonstrated in this article. The details provided here should be sufficient to allow similar experiments to be performed by interested researchers.