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The growth methods described here provide reproducible results with regards to uniformity, chemistry, structure, and morphology. The vanadium precursor is critical to producing the correct stoichiometry of as-deposited ALD films. This particular precursor promotes the +4 vanadium valence state, unlike many of the others listed in the literature that promote the more common +5 valence state. Additionally, this particular precursor has a fairly low vapor pressure and requires heating to provide a sufficient dose to saturate under the conditions given. Since this precursor starts to degrade around 175 °C, this sets an upper temperature limit to both heating of the precursor and ALD growth. Another critical aspect to achieving correct stoichiometry is the ozone concentration (~125 mg/L here) during dosing. Often the concentration of ozone produced by a generator under particular conditions degrades or drifts over time. If this happens, the ozone pulse and purge durations will have to be adjusted to maintain stoichiometry, morphology, and wafer uniformity. What is described here is how to grow ALD VO2 on c-plane sapphire substrates, which includes in-situ ozone pre-treatment. The steps prior to growth for cleaning and nucleation are dependent on the substrate; however, the process described here works for most substrates (inert, oxides, metals, etc.) To determine the best termination cleaning and preparation for VO2 growth, one should consider reactivity between species termination and the vanadium precursor while minimizing any native oxide on the substrate. Finally, this process has been demonstrated on high aspect ratio substrates (up to ~100) but for extreme cases, one should consider an exposure or static ALD method to enhance conformality further.
The ability to achieve high quality, crystalline ALD VO2 films is quite dependent on the post-deposition annealing parameters. The most critical aspect is the pressure, specifically the partial pressure of oxygen. High oxygen pressures lead to faceting and grain growth, eventually causing nanowire formation, as well as results in the V2O5 phase. If the oxygen pressure is too low, oxygen is annealed out of the films resulting in V2O3 phase. Thus, to maintain the correct phase and minimize film roughness, the oxygen pressure should be maintained in the range of 1x10-4 to 7x10-4 Pa. Similarly, the temperature is critical to both being able to crystallize the film, maintain stoichiometry, and minimize roughening of the film. While the temperature of the VO2 film is difficult to measure, empirical findings suggest that crystallization requires stage temperatures greater than 500 °C. At higher temperatures, it is harder to maintain the correct stoichiometry and phase and produce pinhole free films. There is also a trade-off between temperature and anneal time, specifically higher temperatures can reduce the anneal time. Additionally, the anneal duration is directly tied to the thickness of the film. Thicker films require longer times to achieve maximum crystallization. Thus, the oxygen pressure, anneal temperature, and anneal time described in the methods above were optimized to produce high quality VO2 films that exhibit the largest change in optical properties at a nearly ideal transition temperature. Finally, the ramping and cooling rates during the oxygen anneal have an effect on roughness and morphology; the slower these are, the smoother the films.
ALD deposition and subsequent anneal of VO2 produces oriented polycrystalline films with large area uniformity. ALD offers conformally grown films on three-dimensional nanoscale morphologies of almost any substrate. This enables VO2 integration into novel applications, and is especially well suited for optical devices.
Following growth and optical measurements, a model is created which provides a good fit to the data for both the transmittance and reflectance of VO2 in its metallic and insulating phases in the near infrared spectral region (R2 = 0.96-0.99). The reflectance of the infrared insulating phase is the most challenging process in creating this model. Additional oscillator terms were added, but this increased model complexity, only marginally improve the fit in this region. It should be noted that in this model, the superposition of Lorentz oscillators is a common optical model and do not necessarily correspond to specific electronic transitions. Initially, the models included a Drude term, however, after mathematical optimization, the Drude term was essentially eliminated. For this reason, several minimization techniques were examined. However, these different techniques converged upon similar solutions that did not involve a Drude term. The absence of a Drude term in the ALD VO2 could be due to a number of factors, such as 1) doped-semiconductor-like resistivity, or 2) a plasma frequency shift to lower energies and/or large collision rate (damping term), in agreement with the metallic properties of these films.
In the insulating phase, T<60 °C, the permittivity and refractive index of the ALD VO2 agree well with the other fabrication methods (sputtered4,20,21 and pulsed-laser deposition22,23). In the metallic state, T>70 °C, these ALD films exhibit lower loss than the VO2 fabricated by other methods. It is important to note that while different fabrication methods produce somewhat different values for the permittivity and refractive index of VO2, all films show similar trends.
The model in this paper of the temperature and wavelength dependence of the optical permittivity and refractive index agrees well with the experimentally measured data. This model's ability to produce a good quality fit to the measured optical data demonstrates it can reliably predict the optical properties of VO2 as the phase changes from an insulator to a metal. Using these models, the optical properties of VO2 can be predictably tuned by temperature, thickness, and wavelength to design optical systems that achieve static and dynamic goals. These models enable the design and development of optical systems using VO2 in passive and active systems by modifying the film's thickness as well as temperature.