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Transferencia Forward inducida por láser para Flip-chip de embalaje de muñones individuales

Article DOI: 10.3791/52623-v • 08:21 min • March 20th, 2015
March 20th, 2015 •
1, 1
1Center for Microsystems Technology (CMST), Ghent University-imec

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Se demuestra el uso de la transferencia (LIFT) técnica Forward inducida por láser para el montaje flip-chip de componentes optoelectrónicos. Este enfoque proporciona una, rentable y de baja temperatura simple, solución rápida y flexible para chocar de paso fino y unión en el chip escala para alcanzar circuitos de alta densidad para aplicaciones optoelectrónicas.

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Física Número 97 ASCENSOR escritura directa flip-chip interconexiones indio micro-golpes termo-compresión VCSEL
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