Waiting
Login processing...

Trial ends in Request Full Access Tell Your Colleague About Jove
JoVE Journal
Engineering

A subscription to JoVE is required to view this content.
You will only be able to see the first 2 minutes.

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
 

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Article DOI: 10.3791/52623
March 20th, 2015

Chapters

Summary March 20th, 2015

We demonstrate the use of the Laser-induced Forward Transfer (LIFT) technique for flip-chip assembly of optoelectronic components. This approach provides a simple, cost-effective, low-temperature, fast and flexible solution for fine-pitch bumping and bonding on chip-scale for achieving high-density circuits for optoelectronic applications.

Read Article

Get cutting-edge science videos from JoVE sent straight to your inbox every month.

Waiting X
Simple Hit Counter